Vol. 2016, Issue DPC, 2016January 01, 2016 EDT
Critical Process Parameters And Failure Analysis For Temporary Bonded Wafer Stacks
Critical Process Parameters And Failure Analysis For Temporary Bonded Wafer Stacks
Elisabeth Brandl, Karine Abadie, Markus Wimplinger, Juergen Burggraf, Thomas Uhrmann, Julian Bravin, Frank Fournel, Pierre Montmeat,
Brandl, Elisabeth, Karine Abadie, Markus Wimplinger, Juergen Burggraf, Thomas Uhrmann, Julian Bravin, Frank Fournel, and Pierre Montmeat. 2016. “Critical Process Parameters And Failure Analysis For Temporary Bonded Wafer Stacks.” IMAPSource Proceedings 2016 (DPC): 1255–76. https://doi.org/10.4071/2016DPC-WP14.