Vol. 2016, Issue DPC, 2016January 01, 2016 EDT
A study on warpage behavior of EMC in post-mold cure stage using Moldex3D
A study on warpage behavior of EMC in post-mold cure stage using Moldex3D
Hsu Chih-Chung, Srikar Vallury, Srikar Vallury, Kai Lin, Anthony Yang,
Chih-Chung, Hsu, Srikar Vallury, Srikar Vallury, Kai Lin, and Anthony Yang. 2016. “A Study on Warpage Behavior of EMC in Post-Mold Cure Stage Using Moldex3D.” IMAPSource Proceedings 2016 (DPC): 826–50. https://doi.org/10.4071/2016DPC-TP25.