ISSN 2380-4505
Vol. 2016, Issue DPC, 2016January 01, 2016 EDT
Innovated L/S less than 2/2μm Line Embedded 2.1D Organic Substrate Technology
Innovated L/S less than 2/2μm Line Embedded 2.1D Organic Substrate Technology
Yu-Hua Chen,
Articles in Vol. 2016, Issue DPC, 2016
Vol. 2016, Issue DPC, 2016
- Current status and future prospects of panel level packagingSantosh KumarAmandine PizzagalliDave TowneThibault BuissonAndrej IvankovicRozalia Beica
- Emerging Flux Challenges for BGA PackagesMaria DurhamAndy MackieJason Chou
- Laser-based Package Singulation and Trenching for SiPDirk MuellerDavid ClarkJoris VanNunenEd ReaHatim Haloui
- Packaging and Assembly Challenges for 2.5D/3D DevicesGerald BeyerKenneth RebibisArnita PodpodFrancisco CadacioTeng WangAndy MillerEric Beyne
- Investigation of Warpage Behavior of Silicon Semiconductor on a Silicon - Adhesive - Ceramic Integrated Structure at Cryogenic Temperatures--STUDENT BEST PAPER $1500Eyup Can BalogluTuba Okutucu OzyurtZafer Dursunkaya
- Embedded RDL Enabled by Excimer Laser AblationHabib Hichri
- Characterization of Clean after Photoresist Removal from Wafers with Copper Pillars with Lead-Free Solder CapsKimberly PollardRichie PetersMichael PhenisDon Pfettscher
- First Integration Steps of Cu-based DNA Nanowires for interconnectionsChristophe BrunCorentin CarmignaniCheikh Tidiane-DiagneSimona TorrengoPierre-Henri ElchingerPatrick ReynaudAurélie ThuaireSeverine CheramyDidier GasparuttoRaluca TironArianna FiloramoXavier Baillin
- SiP Technology TrendsHamid Eslampour
- Numerical Simulation of Copper Migration in Single Crystal CdTeDa GuoDragica Vasileska
- Preserving Nb Superconducvity in Thin Film Flexible StructuresVaibhav GuptaJohn A. SellersCharles D. EllisSimin ZouGeorge A. HernandezRujun BaiYang CaoDavid B. TuckermanMichael C. Hamilton
- Innovated Process Integration for Panel Size Glass Substrate Manufacturing for SiP ApplicationYu-Hua ChenYu-Chung HsiehWei-Di LinChun-Hsien ChienDyi-Chung Hu
- Precise, high throughput dispensing of thermal interface material in BGA packaging applicationsHanzhuang LiangLinh Rolland
- Low profile Flip-Type or Embedded Silicon Capacitors for decouplingCatherine BunelFranck Murray
- M-Series with Adaptive Patterning for High-Yield Fan-Out SIPCraig BishopSuresh JayaramanBoyd RogersChris ScanlanTim Olson
- An Innovative Package EMC Solution Using a Highly Cost-Effective Sputtered Conformal ShieldNozad KarimRong ZhouJun Fan
- Nonlinear Dynamics and Chaos in Micro/Nano-Scale Systems and ApplicationsYing-Cheng Lai
- A study on warpage behavior of EMC in post-mold cure stage using Moldex3DHsu Chih-ChungSrikar VallurySrikar ValluryKai LinAnthony Yang
- Impact of Top Die Thickness on Cu Pillar Fatigue in Exposed Die 3D PackagesRahul AgarwalSukesh KannanShan GaoRick ReedYong SongJS Paek
- Enhancements of an In Situ Atmospheric System for Real Time Weather MonitoringMark L. AdamsAudrey Rose ShaplandMatthew GutierrezHaley HarrellJessica BlumeCraig Prather
- System level IC packaging - Integration of Key Technologies: TSVs, Interposers, and Advanced IC PackagingMike KellyDave HinerMarnie MatteiRick ReedPaul SilvestriRon Huemoeller
- 2.5D / 3D IC Landscape: Market and Technology TrendsAndrej IvankovicThibault BuissonAmandine PizzagalliDave TowneRozalia Beica
- Improvements in Decision Making Criteria for Thermal WarpageNeil Hubble
- Advances in Aligned Wafer Bonding Enable by High Vacuum ProcessingEric F. PaboChristoph FloetgenBernhard RebhanRazek Nasser
- A Novel Third Order Analog Chaotic OscillatorBenjamin K. RheaFrank T. WernerRemington C. HarrisonRobert N. Dean
- Thin WLFO and based WLSiP enabling WL3D, realized using Temporary Reconstituted Panel Bonding TechnologySteffen KroehnertJose CamposAndré CardosoMariana PiresEoin O'TooleRaquel PintoEmilie JolivetThomas UhrmannElizabeth BrandlJürgen BurggrafHarald WiesbauerJulian BravinMarkus WimplingerPaul Lindner
- TCB Process Options to Achieve the Lowest CostTom Strothmann
- Nonlinear Observability Analysis of Micro-machined Electrostatic Actuators Using Self-SensingChong LiRobert N. DeanGeorge T. Flowers
- Terahertz Diode Arrays and Differential Probes based on Heterogeneous Integration and Silicon MicromachiningRobert M. WeikleC. ZhangS. HawasliS. NadriL. XieN. Scott BarkerA.W. Lichtenberger
- Design of high density SiP for complex computing system in micro SD formatChris Baratt
- The Direct plating copper (DPC) ceramic material on Al2O3/AlN or LTCC (Low-temperature co-fired ceramic) substratesHo-Chieh (Jay) YuJason Huang
- How Mitigation Techniques Affect Reliability Results for BGAsGreg CaswellMelissa Keener
- A MEMS PPA Based Active Vibration Isolator - STUDENT AWARD 3RD PLACE $500Chong LiC. Lavinia ElanaRobert N. DeanGeorge T. Flowers
- Evaluation of High-Speed Copper Plating Products for RDL, Micropillar, and Fan-Out ApplicationsMatthew A ThorsethMark ScalisiInho LeeSang-Min ParkYil-Hak LeeJonathan PrangeMasaaki ImanariMark LefebvreJeff Calvert
- Testing in-package DRAMs and DFX features in 3D high-bandwidth memoryChris Nelson
- A Multiscale Modeling Approach to Study Transport in Silicon Heterojunction Solar CellsPradyumna MuralidharanStuart BowdenStephen M. GoodnickDragica Vasileska
- High Speed Electroplating of 200um High Cu Bumps for Die Stacking ArchitecturesRichard Hollman
- Laser Direct Patterning of Dry Etch BCB Adhesive Layers for Low Temperature Permanent Wafer-to-Wafer BondingKai ZoschkeJ.-U. KimM. WegnerM. GallagherR. BarrJ. CalvertM. ToepperK.-D. Lang
- Si Photonics Deployment Using Cu Pillar Interconnect and Chip On Wafer PlatformMiguel Jimarez
- Embedded Die Packages and Modules for Power Electronics ApplicationsLars BoettcherS. KaraszkiewiczD. ManessisA. Ostmann
- Process and Evaluation of High Reliability Reworkable Edge Bond Adhesives for Large Area BGA ApplicationsSwapan BhattacharyaFei XieDaniel F. BaldwinHan WuKelley HodgeQing Ji
- Photolithography Alignment Mark Transfer System for Low Cost, Advanced Packaging, and Bonded Wafer ApplicationsTom SwarbrickKeith BestCasey DonaherSteve Gardner
- A Matched Filter Developed for Chaotic WaveformsFrank T. WernerBenjamin K. RheaAubrey N. BealWilliam E. AbellJohn P. BaileyRemington C. HarrisonRobert N. DeanMichael C. Hamilton
- Advancements in Glass for Packaging ApplicationsKevin AdrianceGene SmithAric ShoreyRachel LuGene Smith
- Non-Conductive Film (NCF) Underfill: Materials, Performance, and Evolution to Next Generation DevicesEdgardo AnzuresPaul MorganelliPaul MorganelliRobert BarrJeffrey CalvertAvin DhobleDavid FlemingJong-Uk KimHerong LeiJürgen GrafeJulian Haberland
- Washable Coatings for Packaging PracticesJohn MooreAlex Brewer
- Advancements in Flip Chip Assembly Equipment and ProcessesBob ChylakHorst ClaubergDaniel Buergi
- Why Mold When You Can NanoTech?Simon McElrea
- Innovated L/S less than 2/2μm Line Embedded 2.1D Organic Substrate TechnologyYu-Hua Chen
- Design of TSV-based Inductors for Internet of ThingsBruce C KimSaikat Mondal
- Critical Process Parameters And Failure Analysis For Temporary Bonded Wafer StacksElisabeth BrandlKarine AbadieMarkus WimplingerJuergen BurggrafThomas UhrmannJulian BravinFrank FournelPierre Montmeat
- Comparison of hermetic sealing using SAC and SnPb solder for a MEMS pressure sensorMaaike M. Visser TakloBranson BelleJoachim Seland GraffAstrid-Sofie VardøyElisabeth Ramsdal
- Extending WLCSP Packaging Technology Capabilities to Enable Miniaturized Sensor and MEMS Packaging ApplicationsTed Tessier
- Cost Breakdown of 2.5D and 3D PackagingChet PaleskoAmy Palesko
- Ultra Fine Pitch RDL Development in Multi-layer eWLB (embedded Wafer Level BGA) PackagesBernard AdamsWon Kyung ChoiDuk Ju NaAndy YongSeung Wook YoonJaesik LeeUrmi RayRiko Radojcic
- A Survey of Nonlinear Phenomena and Chaos in Microsystems and PackagingAubrey N. BealRobert N. Dean
- Impact of electrical and thermal stresses on TSV radiofrequency performanceAnh Phuong NGUYENUlrike LüdersFrederic Voiron
- Wafer-level packaging for ultra-thin glasses using hermetic room temperature welding technologyHeidi LundénAntti PeltonenAntti Määttänen
- Stacking of 3D Capacitor Chips in a Package for a Compact and Reliable Component Working at High TemperatureStephan BorelP. DescoursB. GoubaultP. NicolasR. FraniatteG. ParatM. PommierS. YonG. SimonC. Bunel
- Nonlinear dynamics induced anomalous Hall effect in topological insulatorsGuanglei WangHongya XuYing-Cheng Lai
- 3D Printing of High Voltage Printed Wiring BoardsEric MacDonaldRyan WickerDavid EspalinAndy KwasPeter Ruby Craig Kief
Chen, Yu-Hua. 2016. “Innovated L/S Less than 2/2μm Line Embedded 2.1D Organic Substrate Technology.” IMAPSource Proceedings 2016 (DPC): 1682–1712. https://doi.org/10.4071/2016DPC-WP42.