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Device Packaging Conference Presentations
Vol. 2016, Issue DPC, 2016January 01, 2016 EDT

Design of TSV-based Inductors for Internet of Things

Bruce C Kim, Saikat Mondal,
TSVInductorsPower Supply
https://doi.org/10.4071/2016DPC-THA34
IMAPSource Conference Papers
Kim, Bruce C, and Saikat Mondal. 2016. “Design of TSV-Based Inductors for Internet of Things.” IMAPSource Proceedings 2016 (DPC): 2111–30. https:/​/​doi.org/​10.4071/​2016DPC-THA34.
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