ISSN 2380-4505
Vol. 2016, Issue DPC, 2016January 01, 2016 EDT
Packaging and Assembly Challenges for 2.5D/3D Devices
Packaging and Assembly Challenges for 2.5D/3D Devices
Gerald Beyer, Kenneth Rebibis, Arnita Podpod, Francisco Cadacio, Teng Wang, Andy Miller, Eric Beyne,
Beyer, Gerald, Kenneth Rebibis, Arnita Podpod, Francisco Cadacio, Teng Wang, Andy Miller, and Eric Beyne. 2016. “Packaging and Assembly Challenges for 2.5D/3D Devices.” IMAPSource Proceedings 2016 (DPC): 1161–91. https://doi.org/10.4071/2016DPC-WP11.