Vol. 2016, Issue DPC, 2016January 01, 2016 EDT
The Direct plating copper (DPC) ceramic material on Al2O3/AlN or LTCC (Low-temperature co-fired ceramic) substrates
The Direct plating copper (DPC) ceramic material on Al2O3/AlN or LTCC (Low-temperature co-fired ceramic) substrates
Yu, Ho-Chieh (Jay), and Jason Huang. 2016. “The Direct Plating Copper (DPC) Ceramic Material on Al2O3/AlN or LTCC (Low-Temperature Co-Fired Ceramic) Substrates.” IMAPSource Proceedings 2016 (DPC): 1773–90. https://doi.org/10.4071/2016DPC-WP46.
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