Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:53517/feed
Device Packaging Conference Presentations
Vol. 2016, Issue DPC, 2016January 01, 2016 EDT

The Direct plating copper (DPC) ceramic material on Al2O3/AlN or LTCC (Low-temperature co-fired ceramic) substrates

Ho-Chieh (Jay) Yu, Jason Huang,
Direct plating copperceramic substrateceramic PCB
https://doi.org/10.4071/2016DPC-WP46
IMAPSource Conference Papers
Yu, Ho-Chieh (Jay), and Jason Huang. 2016. “The Direct Plating Copper (DPC) Ceramic Material on Al2O3/AlN or LTCC (Low-Temperature Co-Fired Ceramic) Substrates.” IMAPSource Proceedings 2016 (DPC): 1773–90. https:/​/​doi.org/​10.4071/​2016DPC-WP46.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system