Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
Sorry, something went wrong. Please try your search again.
×
Use advanced search instead (articles only)
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Device Packaging Conference Presentations
Vol. 2016, Issue DPC, 2016
January 01, 2016 EDT
The Direct plating copper (DPC) ceramic material on Al2O3/AlN or LTCC (Low-temperature co-fired ceramic) substrates
Ho-Chieh (Jay) Yu
,
Jason Huang
,
Direct plating copper
ceramic substrate
ceramic PCB
•
https://doi.org/10.4071/2016DPC-WP46
IMAPSource Conference Papers
Yu, Ho-Chieh (Jay), and Jason Huang. 2016. “The Direct Plating Copper (DPC) Ceramic Material on Al2O3/AlN or LTCC (Low-Temperature Co-Fired Ceramic) Substrates.”
IMAPSource Proceedings
2016 (DPC): 1773–90.
https://doi.org/10.4071/2016DPC-WP46
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats