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ISSN 2380-4505
Device Packaging Conference Presentations
Vol. 2019, Issue DPC, 2019January 01, 2019 EDT

Rapid On-Substrate Curing of Thick Protective Package Sealing for Automotive Assembly

John Moore, Jevon Spencer,
ElastomerImpermeableResistant
https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_TP3_025
IMAPSource Conference Papers
Moore, John, and Jevon Spencer. 2019. “Rapid On-Substrate Curing of Thick Protective Package Sealing for Automotive Assembly.” IMAPSource Proceedings 2019 (DPC): 573–615. https:/​/​doi.org/​10.4071/​2380-4491-2019-DPC-Presentation_TP3_025.

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