Vol. 2019, Issue DPC, 2019January 01, 2019 EDT
Key Enabling Materials for 3DIC Fabrication and Device Performance
Key Enabling Materials for 3DIC Fabrication and Device Performance
Michael Gallagher, Ed Anzures, Robert Auger, Rosemary Bell, Berry Paul, Hua Dong, Michelle Ho, Joe Lachowski, Yil-Hak Lee, Masaki Kondo, Julia Kozhukh, Paul Morganelli, Janet Okada, Ravi Pokhrel, Jonathan Prange, Matthew VanHanehem,
Gallagher, Michael, Ed Anzures, Robert Auger, Rosemary Bell, Berry Paul, Hua Dong, Michelle Ho, et al. 2019. “Key Enabling Materials for 3DIC Fabrication and Device Performance.” IMAPSource Proceedings 2019 (DPC): 1145–64. https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_THA1_076.