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ISSN 2380-4505
Device Packaging Conference Presentations
Vol. 2019, Issue DPC, 2019January 01, 2019 EDT

Key Enabling Materials for 3DIC Fabrication and Device Performance

Michael Gallagher, Ed Anzures, Robert Auger, Rosemary Bell, Berry Paul, Hua Dong, Michelle Ho, Joe Lachowski, Yil-Hak Lee, Masaki Kondo, Julia Kozhukh, Paul Morganelli, Janet Okada, Ravi Pokhrel, Jonathan Prange, Matthew VanHanehem,
3diccopper-copper hybrid bondingCMP
https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_THA1_076
IMAPSource Conference Papers
Gallagher, Michael, Ed Anzures, Robert Auger, Rosemary Bell, Berry Paul, Hua Dong, Michelle Ho, et al. 2019. “Key Enabling Materials for 3DIC Fabrication and Device Performance.” IMAPSource Proceedings 2019 (DPC): 1145–64. https:/​/​doi.org/​10.4071/​2380-4491-2019-DPC-Presentation_THA1_076.

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