ISSN 2380-4505
Vol. 2019, Issue DPC, 2019January 01, 2019 EDT
Minimum Requirements for a Successful Automotive Qualification With Focus on Packaging
Minimum Requirements for a Successful Automotive Qualification With Focus on Packaging
Vinayak Pandey,
Articles in Vol. 2019, Issue DPC, 2019
Vol. 2019, Issue DPC, 2019
- A PCB Sensor for Magnetic MaterialsRobert N. DeanLauren E. Beckingham
- Quasi-Optical Testbed for Wideband THz On-Wafer MeasurementsYiran CuiGeorgios C. Trichopoulos
- Performance Comparison Between Surface-mount and Embedded Power ModulesGerald Weis
- Dicing Tape Performance in a Plasma Dicing EnvironmentStewart FultonOliver AnsellJanet HopkinsTaku UmemotoTakuo Nishida
- Minimum Requirements for a Successful Automotive Qualification With Focus on PackagingVinayak Pandey
- Design, Processes & Technology Co-design MethodologyDiane PengBaqar Tabrez
- Process Control for Advanced Packaging MetallizationEugene ShalytMichael PavlovDanni LinMichael MacEwanHelen LuPaul Okagbare
- Thinking in 3D - The New ArchitectureJavi DeLaCruz
- Package Technologies for the 4th Industrial RevolutionDan Oh
- Ultra-low Warpage and Anhydride-free Liquid Compression Molding Materials for Advanced Semiconductor PackagingTim ChampagneJay ChaoKazuyasu TanakaRamachandran TrichurRong Zhang
- Development of High Density RDL Technologies for Panel Level ProcessingLars BöttcherS. KaraszkiewiczF. ScheinR. KahleA. Ostmann
- Multi-chip module integration of Hybrid Silicon CMOS and GaN Technologies for RF TransceiversJennifer KitchenSoroush MoallemiSumit Bhardwaj
- Processing Through Glass Via (TGV) InterposersCharles G. WoychikJohn LaufferScott Pollard+Raj Parmar+Michael GaigeWilliam WilsonJames CareyMatthew Neely
- Additive Manufacturing of Dielectric MicrostructuresKurt Christenson
- Low Temperature flip chip bonding technology applicable to flexible hybrid electronics in the IoT eraHiroshi Komatsu
- Sensor Integration: Feynman or Moore?Benedetto Vigna
- Temporary and permanent bonding enables 3D integration of ultrathin wafersElisabeth BrandlThomas UhrmannMariana PiresStefan JungJürgen BurggrafMatthew Koch
- LiDAR PackagingTim Nguyen
- SYSTEM-LEVEL, POST-LAYOUT ELECTRICAL ANALYSIS FOR HIGH-DENSITY ADVANCED PACKAGINGTarek Ramadan
- The Advantages of using 3D Printed MEMS DevicesArthur BondBrent BottenfieldMark L. AdamsRobert N. Dean
- Quick Prototyping Design for More than Moore eraYoko FujitaKazukani KogaShintaro OhtaniDaisuke TsuTsui
- UV Projection Scanner Performance in Thick Resists for High Aspect Ratio Cu PillarsWilliam VisFabian BenthausHabib HichriMarkus Arendt
- Cost Comparison of Panel Level and Wafer Level Fan-out PackagingAmy Lujan
- Power electronics thermal solutions using thermally conductive polyimide filmsRajesh TripathiSejin ImDouglas DevotoJoshua MajorSreekant NarumanchiPaul ParetXuhui Feng
- Embedded SIP Modules for next-GEN Heterogeneous “POWER-Devices”Kevin MoodyNick Stukan
- Rapid On-Substrate Curing of Thick Protective Package Sealing for Automotive AssemblyJohn MooreJevon Spencer
- Photosensitive Glass-Ceramics for Heterogeneous IntegrationJeb FlemmingKyle McWethyTim MezelLuis ChenowethCarrie Schmidt
- Semiconductor-on-Polymer Wafer Level Chip Scale PackagingDoug Hackler
- Investigation of a Proactive Glass Filler Removal in IC Substrate Build Up Films and its Effect on Topography and Copper Adhesion ReliabilityStefan KempaWolfgang FrizFlorian GaulEllen HabigLaurence J. GregoriadesRoger Massey
- Automated Daisy Chain Generation and VerificationTom Whipple
- Microbump Processing for 3D IC IntegrationFeng LiAndrew W. OwensQianyi Li
- Power Management in Modern Cell PhonesTodd Sutton
- Organic Substrate Technologies for Fingerprint SensorsShengmin Wen
- Power Module Packaging: Market and Technology TrendsElena BarbariniClaire Troadec
- 3D IC: An Industry OverviewVinayak Pandey
- What is driving the TSV business: Market & Technology TrendsSantosh Kumar
- Cars and Clouds: New Drivers for Efficient Power ManagementMike Seddon
- Solder paste wicking in socketable BGAsOmkar GupteVanessa SmetGregorio MurtagianRao Tummala
- Electroplating Fundamentals for Coplanarity ImprovementMarvin Bernt
- 30μm Thick Cu RDL in WLCSPJacinta AmanlimKenny CaoZhang LiK.H. Tan
- ENEPIG Reliability - Enhancement by Simple Drop in Process ChangesKuldip JohalRick Nichols
- Material Design Advancement Create Multifunctional Materials for Single-Layer Bonding and DebondingLuke PrengerXiao LiuQi WuRama Puligadda
- Thermal Characterization of Quasi-Vertical GaAs Schottky Diodes Integrated on Silicon Using Thermoreflectance and Electrical Transient MeasurementsRobert M. WeikleS. NadriC.M. MooreN. D. SauberL. XieM. E. CybereyN. Scott BarkerA. W. LichtenbergerM Zebarjadi
- The bifurcation of advanced packagingJohn Park
- Advanced barrier and seed layer deposition enabling multiple type of TSVs integrationThierry MourierMathilde GottardiPierre-Emile PhilipSophie VerrunGilles RomeroGaelle GuittetCéline DoussotVincent Mevellec
- Versatility of Fan Out – Simple 2D to Complex 3DJohn Hunt
- Copper Ball Voids: Failure Mechanisms and Methods of Controlling at High Temperature Automotive ApplicationChu-Chung LeeTuAnh TranVarughese MathewRusli IbrahimPoh-Leng Eu
- Further Physical Characteristics of Vacuum vs. Atmospheric Baked Polymers for FOWLP ProcessingBill MoffatKen SautterCharadutta GalandeKaushal SinghZia Karim
- Novel Formaldehyde-Free Electroless Copper for Plating on Next Generation SubstratesChristian WendelnEdith SteinhäuserLutz StampBexy Dosse-GomezElisa LanghammerSebastian ReiberSebastian DünnebeilSandra RöselerRoger Massey
- Key Enabling Materials for 3DIC Fabrication and Device PerformanceMichael GallagherEd AnzuresRobert AugerRosemary BellBerry PaulHua DongMichelle HoJoe LachowskiYil-Hak LeeMasaki KondoJulia KozhukhPaul MorganelliJanet OkadaRavi PokhrelJonathan PrangeMatthew VanHanehem
- Solder-Joint Reliability of BGA Packages in Automotive ApplicationsBurton CarpenterAndrew MawerMollie BensonJohn ArthurBetty Young
- Enabling Early and Fast Thermal Simulation for 3D Multi-Die System DesignsTunir DeyKazunari KogaHumair Mandavia
- Packaging Trends and Challenges for Power DevicesE. Jan Vardaman
- IC MARKET UPDATE AND CHINA IMPACT ANALYSISBill McClean
- Through Glass Vias for hermetically sealed High Frequency ApplicationKevin KröhnertM. WöhrmannN. JürgensenK. D. LangT. GallerT. ChalounC. WaldschmidtM. Schulz-RuhtenbergN. AmbrosiusR. Ostholt
Pandey, Vinayak. 2019. “Minimum Requirements for a Successful Automotive Qualification With Focus on Packaging.” IMAPSource Proceedings 2019 (DPC): 258–83. https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_TA3_064.