ISSN 2380-4505
Vol. 2019, Issue DPC, 2019January 01, 2019 EDT
Package Technologies for the 4th Industrial Revolution
Package Technologies for the 4th Industrial Revolution
Dan Oh,
Articles in Vol. 2019, Issue DPC, 2019
Vol. 2019, Issue DPC, 2019
- A PCB Sensor for Magnetic MaterialsRobert N. DeanLauren E. Beckingham
- Quasi-Optical Testbed for Wideband THz On-Wafer MeasurementsYiran CuiGeorgios C. Trichopoulos
- Performance Comparison Between Surface-mount and Embedded Power ModulesGerald Weis
- Dicing Tape Performance in a Plasma Dicing EnvironmentStewart FultonOliver AnsellJanet HopkinsTaku UmemotoTakuo Nishida
- Minimum Requirements for a Successful Automotive Qualification With Focus on PackagingVinayak Pandey
- Design, Processes & Technology Co-design MethodologyDiane PengBaqar Tabrez
- Process Control for Advanced Packaging MetallizationEugene ShalytMichael PavlovDanni LinMichael MacEwanHelen LuPaul Okagbare
- Thinking in 3D - The New ArchitectureJavi DeLaCruz
- Package Technologies for the 4th Industrial RevolutionDan Oh
- Ultra-low Warpage and Anhydride-free Liquid Compression Molding Materials for Advanced Semiconductor PackagingTim ChampagneJay ChaoKazuyasu TanakaRamachandran TrichurRong Zhang
- Development of High Density RDL Technologies for Panel Level ProcessingLars BöttcherS. KaraszkiewiczF. ScheinR. KahleA. Ostmann
- Multi-chip module integration of Hybrid Silicon CMOS and GaN Technologies for RF TransceiversJennifer KitchenSoroush MoallemiSumit Bhardwaj
- Processing Through Glass Via (TGV) InterposersCharles G. WoychikJohn LaufferScott Pollard+Raj Parmar+Michael GaigeWilliam WilsonJames CareyMatthew Neely
- Additive Manufacturing of Dielectric MicrostructuresKurt Christenson
- Low Temperature flip chip bonding technology applicable to flexible hybrid electronics in the IoT eraHiroshi Komatsu
- Sensor Integration: Feynman or Moore?Benedetto Vigna
- Temporary and permanent bonding enables 3D integration of ultrathin wafersElisabeth BrandlThomas UhrmannMariana PiresStefan JungJürgen BurggrafMatthew Koch
- LiDAR PackagingTim Nguyen
- SYSTEM-LEVEL, POST-LAYOUT ELECTRICAL ANALYSIS FOR HIGH-DENSITY ADVANCED PACKAGINGTarek Ramadan
- The Advantages of using 3D Printed MEMS DevicesArthur BondBrent BottenfieldMark L. AdamsRobert N. Dean
- Quick Prototyping Design for More than Moore eraYoko FujitaKazukani KogaShintaro OhtaniDaisuke TsuTsui
- UV Projection Scanner Performance in Thick Resists for High Aspect Ratio Cu PillarsWilliam VisFabian BenthausHabib HichriMarkus Arendt
- Cost Comparison of Panel Level and Wafer Level Fan-out PackagingAmy Lujan
- Power electronics thermal solutions using thermally conductive polyimide filmsRajesh TripathiSejin ImDouglas DevotoJoshua MajorSreekant NarumanchiPaul ParetXuhui Feng
- Embedded SIP Modules for next-GEN Heterogeneous “POWER-Devices”Kevin MoodyNick Stukan
- Rapid On-Substrate Curing of Thick Protective Package Sealing for Automotive AssemblyJohn MooreJevon Spencer
- Photosensitive Glass-Ceramics for Heterogeneous IntegrationJeb FlemmingKyle McWethyTim MezelLuis ChenowethCarrie Schmidt
- Semiconductor-on-Polymer Wafer Level Chip Scale PackagingDoug Hackler
- Investigation of a Proactive Glass Filler Removal in IC Substrate Build Up Films and its Effect on Topography and Copper Adhesion ReliabilityStefan KempaWolfgang FrizFlorian GaulEllen HabigLaurence J. GregoriadesRoger Massey
- Automated Daisy Chain Generation and VerificationTom Whipple
- Microbump Processing for 3D IC IntegrationFeng LiAndrew W. OwensQianyi Li
- Power Management in Modern Cell PhonesTodd Sutton
- Organic Substrate Technologies for Fingerprint SensorsShengmin Wen
- Power Module Packaging: Market and Technology TrendsElena BarbariniClaire Troadec
- 3D IC: An Industry OverviewVinayak Pandey
- What is driving the TSV business: Market & Technology TrendsSantosh Kumar
- Cars and Clouds: New Drivers for Efficient Power ManagementMike Seddon
- Solder paste wicking in socketable BGAsOmkar GupteVanessa SmetGregorio MurtagianRao Tummala
- Electroplating Fundamentals for Coplanarity ImprovementMarvin Bernt
- 30μm Thick Cu RDL in WLCSPJacinta AmanlimKenny CaoZhang LiK.H. Tan
- ENEPIG Reliability - Enhancement by Simple Drop in Process ChangesKuldip JohalRick Nichols
- Material Design Advancement Create Multifunctional Materials for Single-Layer Bonding and DebondingLuke PrengerXiao LiuQi WuRama Puligadda
- Thermal Characterization of Quasi-Vertical GaAs Schottky Diodes Integrated on Silicon Using Thermoreflectance and Electrical Transient MeasurementsRobert M. WeikleS. NadriC.M. MooreN. D. SauberL. XieM. E. CybereyN. Scott BarkerA. W. LichtenbergerM Zebarjadi
- The bifurcation of advanced packagingJohn Park
- Advanced barrier and seed layer deposition enabling multiple type of TSVs integrationThierry MourierMathilde GottardiPierre-Emile PhilipSophie VerrunGilles RomeroGaelle GuittetCéline DoussotVincent Mevellec
- Versatility of Fan Out – Simple 2D to Complex 3DJohn Hunt
- Copper Ball Voids: Failure Mechanisms and Methods of Controlling at High Temperature Automotive ApplicationChu-Chung LeeTuAnh TranVarughese MathewRusli IbrahimPoh-Leng Eu
- Further Physical Characteristics of Vacuum vs. Atmospheric Baked Polymers for FOWLP ProcessingBill MoffatKen SautterCharadutta GalandeKaushal SinghZia Karim
- Novel Formaldehyde-Free Electroless Copper for Plating on Next Generation SubstratesChristian WendelnEdith SteinhäuserLutz StampBexy Dosse-GomezElisa LanghammerSebastian ReiberSebastian DünnebeilSandra RöselerRoger Massey
- Key Enabling Materials for 3DIC Fabrication and Device PerformanceMichael GallagherEd AnzuresRobert AugerRosemary BellBerry PaulHua DongMichelle HoJoe LachowskiYil-Hak LeeMasaki KondoJulia KozhukhPaul MorganelliJanet OkadaRavi PokhrelJonathan PrangeMatthew VanHanehem
- Solder-Joint Reliability of BGA Packages in Automotive ApplicationsBurton CarpenterAndrew MawerMollie BensonJohn ArthurBetty Young
- Enabling Early and Fast Thermal Simulation for 3D Multi-Die System DesignsTunir DeyKazunari KogaHumair Mandavia
- Packaging Trends and Challenges for Power DevicesE. Jan Vardaman
- IC MARKET UPDATE AND CHINA IMPACT ANALYSISBill McClean
- Through Glass Vias for hermetically sealed High Frequency ApplicationKevin KröhnertM. WöhrmannN. JürgensenK. D. LangT. GallerT. ChalounC. WaldschmidtM. Schulz-RuhtenbergN. AmbrosiusR. Ostholt
Oh, Dan. 2019. “Package Technologies for the 4th Industrial Revolution.” IMAPSource Proceedings 2019 (DPC): 1095–1117. https://doi.org/10.4071/2380-4491-2019-DPC-Keynote4_DanOh.