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ISSN 2380-4505
Device Packaging Conference Presentations
Vol. 2019, Issue DPC, 2019January 01, 2019 EDT

Further Physical Characteristics of Vacuum vs. Atmospheric Baked Polymers for FOWLP Processing

Bill Moffat, Ken Sautter, Charadutta Galande, Kaushal Singh, Zia Karim,
multilayer polymer processfan-outFOWLP
https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_THA2_012
IMAPSource Conference Papers
Moffat, Bill, Ken Sautter, Charadutta Galande, Kaushal Singh, and Zia Karim. 2019. “Further Physical Characteristics of Vacuum vs. Atmospheric Baked Polymers for FOWLP Processing.” IMAPSource Proceedings 2019 (DPC): 1257–69. https:/​/​doi.org/​10.4071/​2380-4491-2019-DPC-Presentation_THA2_012.

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