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Device Packaging Conference Presentations
Vol. 2019, Issue DPC, 2019January 01, 2019 EDT

Solder paste wicking in socketable BGAs

Omkar Gupte, Vanessa Smet, Gregorio Murtagian, Rao Tummala,
Ball AttachSocketable BGASolder paste wicking
https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_TP2_024
IMAPSource Conference Papers
Gupte, Omkar, Vanessa Smet, Gregorio Murtagian, and Rao Tummala. 2019. “Solder Paste Wicking in Socketable BGAs.” IMAPSource Proceedings 2019 (DPC): 429–52. https:/​/​doi.org/​10.4071/​2380-4491-2019-DPC-Presentation_TP2_024.
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