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Device Packaging Conference Presentations
Vol. 2017, Issue DPC, 2017
January 01, 2017 EDT
Addressing Next Generation Packaging and IoT with Glass Solutions
Aric Shorey
,
Rachel Lu
,
Gene Smith
,
Glass
TGV
Interposer
•
https://doi.org/10.4071/2017DPC-TA1_Presentation4
IMAPSource Conference Papers
Shorey, Aric, Rachel Lu, and Gene Smith. 2017. “Addressing Next Generation Packaging and IoT with Glass Solutions.”
IMAPSource Proceedings
2017 (DPC): 1–19.
https://doi.org/10.4071/2017DPC-TA1_Presentation4
.
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