ISSN 2380-4505
Vol. 2017, Issue DPC, 2017January 01, 2017 EDT
New Wafer Level Packaging Concept for Power LEDS
New Wafer Level Packaging Concept for Power LEDS
Marion Volpert, B. Soulier, P. Peray, N. Ait-Mani, A. Gasse, D. Henry, C. Tallet, V. Beix, A. Aboulaich, C. Zheng-Sung, J. L. Diot,
Volpert, Marion, B. Soulier, P. Peray, N. Ait-Mani, A. Gasse, D. Henry, C. Tallet, et al. 2017. “New Wafer Level Packaging Concept for Power LEDS.” IMAPSource Proceedings 2017 (DPC): 1–27. https://doi.org/10.4071/2017DPC-TP3_Presentation2.