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Device Packaging Conference Presentations
Vol. 2017, Issue DPC, 2017January 01, 2017 EDT

RDL Multilayer Metallization Approaches for TGV

Roupen Keusseyan, Tim Mobley, Elizabeth Young-Dohe,
TGV (Through Glass Via) TechnologyRDL (Redistribution Layers)High Performance
https://doi.org/10.4071/2017DPC-TA1_Presentation3
IMAPSource Conference Papers
Keusseyan, Roupen, Tim Mobley, and Elizabeth Young-Dohe. 2017. “RDL Multilayer Metallization Approaches for TGV.” IMAPSource Proceedings 2017 (DPC): 1–11. https:/​/​doi.org/​10.4071/​2017DPC-TA1_Presentation3.

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