Vol. 2017, Issue DPC, 2017January 01, 2017 EDT
Cost Comparison of Fan-out Wafer Level Packaging and Flip Chip Packaging
Cost Comparison of Fan-out Wafer Level Packaging and Flip Chip Packaging
Amy Lujan,
Lujan, Amy. 2017. “Cost Comparison of Fan-out Wafer Level Packaging and Flip Chip Packaging.” IMAPSource Proceedings 2017 (DPC): 1–37. https://doi.org/10.4071/2017DPC-TA2_Presentation3.