ISSN 2380-4505
Articles in Vol. 2017, Issue DPC, 2017
Vol. 2017, Issue DPC, 2017
- Heterogeneous Integration “packaging the Future”Ron Huemoeller
- Neither IOT Nor 5G without New Technoloygy!IMAPSource Proceedings
- A PCB Sensor Suite for Monitoring the Effects of Annual Variations in Precipitation Rates on Alpine Lakes in Rocky Mountain National ParkRobert DeanIsabella A. OleksyDaniel W. Bowker
- Embedded Components in PCBIMAPSource Proceedings
- Minimizing Film Stress and Degradation in Thin-Film Niobium Superconducting CablesVaibhav GuptaJohn A. SellersCharles D. EllisBhargav YelamanchiliSimin ZouYang CaoDavid B. TuckermanMichael C. Hamilton
- Multiscale modeling of transport in silicon heterojunction solar cellsPradyumna MuralidharanStephen M. GoodnickDragica Vasileska
- Electronic Chaotic Oscillator Realization with Potential Uses in Communication SystemsBenjamin K. RheaF. T. WernerR. C. HarrisonA. N. BealR. N. Dean
- Speed and Accuracy Optimization for Fan-Out Die PlacementTom Strothmann
- Pillar Density Modulation in a Semi-packed MEMS ColumnRyan ChanBishnu RegmiAna Lopez MarcanoSarah El-HelwMasoud Agah
- Precise underfill dispense in high-throughput chip-on-wafer packagingHanzhuang Liang
- Application of SU-8 photoresist as a multi-functional structural dielectric layer in FOWLPRaquel PintoAndré CardosoSara RibeiroCarlos BrandãoJoão GasparRizwan GillHelder FonsecaMargaret Costa
- RDL Multilayer Metallization Approaches for TGVRoupen KeusseyanTim MobleyElizabeth Young-Dohe
- The Effect of Processing Parameters on the Physical and Microwave Electrical Properties of Low Temperature Co-fired CeramicsJim WalkerJerry AguirreEd GraddyJim Henry
- Silicon Wafer Integrated Fan-out TechnologyCurtis ZwengerGeorge ScottRon HuemoellerWonChul DoWonGeol LeeJiHun Yi
- A Compact and Low Power Realization of a High Frequency Chaotic OscillatorR. Chase HarrisonBenjamin K. RheaFrank T. WernerRobert N. Dean
- What's Happening in China Advanced Semiconductor Packaging Landscape?Santosh Kumar
- Plasmon Rulers for 3D IC AlignmentHao JiangJasbir N. PatelBozena Kaminska
- Integration of Chemically Amplified Photoresist and High-Speed Copper Plating Products for Advanced Packaging ApplicationsRosemary BellJoseph LachowskiMitsuru HagaInho LeeRegina ChoMatthew ThorsethJonathan PrangeMark ScalisiYi QinYun-Hyeon KimWataru TachikawaYoon Joo KimMark LefebvreJeff Calvert
- Cost Comparison of Fan-out Wafer Level Packaging and Flip Chip PackagingAmy Lujan
- Advanced Materials and Interconnect Technologies for Next Generation Smart DevicesRozalia BeicaEric Huenger
- Cu Pillar, RDL and Via Fill Challenges facing FOWLPEric GongoraElie NajjarThomas RichardsonLeo LinehanJohn Commander
- 3D High Density: technology, roadmap and applicationsLucile ArnaudSeverine CheramyAmandine JouveLucile ArnaudClaire FenouilletPerrine BatudeMaud Vinet
- Advanced Packaging Lithography and Inspection Solutions for Next Generation FOWLP-FOPLP ProcessingElvino Da SilveiraKeith BestGurvinder SinghRoger McCleary
- Multi-Scale Modeling of Self Heating Effects on Power Consumption in Silicon CMOS DevicesRobin DaughertyDragica Vasileska
- Laser Debonding for 2.5D, 3D and Emerging Advanced Packaging SolutionsT. UhrmannElisabeth BrandlThomas UhrmannMartin EibelhuberHarald WiesbauerJulian BravinMarkus WimplingerPaul Lindner
- Manufacturability trade-offs of bare-die FCBGA package using thin or core-less substrateAnkita VermaBaqar TabrezLam DuongMartin Wuest
- The Influence of Intermetallic Compounds, (IMC), on High Speed Shear Testing with a Specific Interest in Electroless Palladium / Autocatalytic GoldRichard John Nichols
- Technology Review of System in PackageYashashree S. WaseFeng Li
- Hygrothermal aging of flip-chip assembled MOEMSMaaike M. Visser TakloDaniel Nilsen WrightSigbjørn KolbergAstrid-Sofie B. VardøyFaycal HamouAndreas VoglHelge KristiansenErik KallandThor Bakke
- Development of Fan Out Package Platform for High Performance and RF ApplicationsGaurav SharmaGaurav SharmaAdam BeeceGao ShanMarcel Wieland
- Trends in MEMS & Sensor IntegrationSitaram Arkalgud
- First Demonstration of Fine Line RDL Yield Enhancement using an Innovative Ozone Treatment Process for Panel Fan-out and InterposersAtul GuptaEric SnyderChristiane GottschalkeKevin WenzelJames GunnHao LuYuya SuzukiVenky SundaramRao Tummala
- Super-persistent Currents in Chaotic Dirac Fermion SystemsHongya Xu
- Fan-Out Packaging: Technologies and market trendsJerome Azemar
- Wafer Thinning for Advanced Packaging ApplicationsLaura MauerJohn TaddeiScott Kroeger
- Advanced Wireless Sensor Nodes - MSFCKosta Varnavas
- The Package Becomes the SystemBruce J. Barbara
- Advanced Packaging for Automotive Dashboard ApplicationNokibul Islam
- Electromigration in sintered nanoporous copperSebastian GerkeXiaoyu ChenLuca Del CarroJonas ZuercherThomas Brunschwiler
- 3D Modular Power Electronic Packages and Modules for different power classes - from 50W to 50kWLars BöttcherS. KaraszkiewiczD. ManessisA. Ostmann
- Modeling Nonlinear MEMS Beams and the Chaotic Duffing Oscillator in SPICEAubrey Nathan Beal
- Application of 3D PLUS WDoD technology for the manufacturing of electronic modules in implantable medical productsPascal Couderc
- Integration of MEMS in Fan-Out Wafer-Level Packaging Technology based System-in-Package (WLSiP)Steffen KroehnertAndré CardosoSteffen KroehnertRaquel PintoElisabete FernandesIsabel Barros
- Ultra-Thin, Fine-Pitch Step Stencils For Miniature Component AssemblyPhani Vallabhajosyula
- Addressing Next Generation Packaging and IoT with Glass SolutionsAric ShoreyRachel LuGene Smith
- New Wafer Level Packaging Concept for Power LEDSMarion VolpertB. SoulierP. PerayN. Ait-ManiA. GasseD. HenryC. TalletV. BeixA. AboulaichC. Zheng-SungJ. L. Diot
- Micromachined Interfaces for Metrology and Packaging Applications in the Submillimeter-Wave BandRobert M. WeikleH. LiA. ArsenovicS. NadriL. XieM.F. BauwensN. AlijabbariN. Scott BarkerA.W. Lichtenberger
- What is driving the 3D TSV technologies business: Market update and technical trendsSantosh KumarThibault Buisson
- THE CHANGING LANDSCAPE IN THE BACK ENDBrandon Prior
- Control of Tin Silver Electroplating BathVinh Nguyen
- Advanced 3D eWLB-SiP (embedded Wafer Level Ball Grid Array – System in Package) TechnologySeung Wook Yoon
- The effect of underfill on thermal stresses on logic ASIC and its electrical performanceBabak TalebanpourDoug Link
- Market Drivers and Packaging Trends for Automotive ElectronicsE. Jan Vardaman
- Thermomechanical Modeling of Sintered Silver – A Fracture Mechanics-Based ApproachPaul ParetDouglas DeVotoSreekant Narumanchi
- Development of high-yield and high-reliability design for high-performance ultra large scale 3DLSI processorHideki Kitada
- Low Temperature Curable PI/PBO for Advanced PackagingDaisaku MatsukawaTadamitsu NakamuraTetsuya EnomotoNoriyuki YamazakiMasayuki OheTakeharu MotobeMasato Nishimura
- Backside Shield against Physical Attacks for Secure ICs.Stéphan BORELEdouard DESCHASEAUXJean CHARBONNIERPhilippe MEDINAStéphanie ANCEAUJessy CLEDIERERomain WACQUEZJacques FOURNIEREric JALAGUIERChristophe PLANTIERGilles SIMON
- Transient Liquid Phase Sintering Pastes in Heterogeneous IntegrationCatherine Shearer
- Thermal warpage measurement system for environmental test of automotive devicesMitsuhiro Ishihara
- FOWLP Technology as an Wafer Level System in Packaging (SiP) SolutionLewis(In Soo) Kang
- Have the Semiconductor Industry Grow AgainJim Walker
- True Random Source from Integratable Chaotic CircuitsNed CorronMarko MilosavljevicJon Blakely
- Embedded Si Fan Out: A Low Cost Wafer Level Packaging Technology Without Molding and De-bonding ProcessesHong XieDaquan YuZhenrui HuangZhiyi XiaoLi YangMin Xiang
- Evaluation of an In Situ Atmospheric System for Real Time Weather MonitoringJ. Craig PratherMichael BoltHaley HarrellTyler HortonMark L. Adams
- A Wireless Hay Bale Status Sensor Suite Using PCB Sensor TechnologyJeff D. CravenAndrew W. MuschaR. Chase HarrisonMarkus A. R. KreitzerRobert N. DeanBeth A. Guertal
- Curved CMOS Image Sensors: Packaging Issues, Applications and RoadmapsBertrand ChambionG. MoulinS. CapletC. GaschetS. GetinA. VandeneyndeW. JahnD. HenryE. Hugot
Prior, Brandon. 2017. “THE CHANGING LANDSCAPE IN THE BACK END.” IMAPSource Proceedings 2017 (DPC): 1–20. https://doi.org/10.4071/2017DPC-GBC_Presentation4.