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Device Packaging Conference Presentations
Vol. 2017, Issue DPC, 2017January 01, 2017 EDT

Application of SU-8 photoresist as a multi-functional structural dielectric layer in FOWLP

Raquel Pinto, André Cardoso, Sara Ribeiro, Carlos Brandão, João Gaspar, Rizwan Gill, Helder Fonseca, Margaret Costa,
Fan-out Wafer Level PackageSU-8MEMs
https://doi.org/10.4071/2017DPC-TP2_Presentation3
IMAPSource Conference Papers
Pinto, Raquel, André Cardoso, Sara Ribeiro, Carlos Brandão, João Gaspar, Rizwan Gill, Helder Fonseca, and Margaret Costa. 2017. “Application of SU-8 Photoresist as a Multi-Functional Structural Dielectric Layer in FOWLP.” IMAPSource Proceedings 2017 (DPC): 1–19. https:/​/​doi.org/​10.4071/​2017DPC-TP2_Presentation3.
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