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Device Packaging Conference Presentations
Vol. 2017, Issue DPC, 2017
January 01, 2017 EDT
Electromigration in sintered nanoporous copper
Sebastian Gerke
,
Xiaoyu Chen
,
Luca Del Carro
,
Jonas Zuercher
,
Thomas Brunschwiler
,
Electromigration
Nanoporous copper
all-copper interconnects
•
https://doi.org/10.4071/2017DPC-WP1_Presentation4
IMAPSource Conference Papers
Gerke, Sebastian, Xiaoyu Chen, Luca Del Carro, Jonas Zuercher, and Thomas Brunschwiler. 2017. “Electromigration in Sintered Nanoporous Copper.”
IMAPSource Proceedings
2017 (DPC): 1–47.
https://doi.org/10.4071/2017DPC-WP1_Presentation4
.
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