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Device Packaging Conference Presentations
Vol. 2017, Issue DPC, 2017January 01, 2017 EDT

Integration of Chemically Amplified Photoresist and High-Speed Copper Plating Products for Advanced Packaging Applications

Rosemary Bell, Joseph Lachowski, Mitsuru Haga, Inho Lee, Regina Cho, Matthew Thorseth, Jonathan Prange, Mark Scalisi, Yi Qin, Yun-Hyeon Kim, Wataru Tachikawa, Yoon Joo Kim, Mark Lefebvre, Jeff Calvert,
Chemically amplified photoresistHigh-speed copper electroplatingIntegration and throughput
https://doi.org/10.4071/2017DPC-WP1_Presentation3
IMAPSource Conference Papers
Bell, Rosemary, Joseph Lachowski, Mitsuru Haga, Inho Lee, Regina Cho, Matthew Thorseth, Jonathan Prange, et al. 2017. “Integration of Chemically Amplified Photoresist and High-Speed Copper Plating Products for Advanced Packaging Applications.” IMAPSource Proceedings 2017 (DPC): 1–22. https:/​/​doi.org/​10.4071/​2017DPC-WP1_Presentation3.
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