Vol. 2017, Issue DPC, 2017January 01, 2017 EDT
Integration of Chemically Amplified Photoresist and High-Speed Copper Plating Products for Advanced Packaging Applications
Integration of Chemically Amplified Photoresist and High-Speed Copper Plating Products for Advanced Packaging Applications
Rosemary Bell, Joseph Lachowski, Mitsuru Haga, Inho Lee, Regina Cho, Matthew Thorseth, Jonathan Prange, Mark Scalisi, Yi Qin, Yun-Hyeon Kim, Wataru Tachikawa, Yoon Joo Kim, Mark Lefebvre, Jeff Calvert,
Bell, Rosemary, Joseph Lachowski, Mitsuru Haga, Inho Lee, Regina Cho, Matthew Thorseth, Jonathan Prange, et al. 2017. “Integration of Chemically Amplified Photoresist and High-Speed Copper Plating Products for Advanced Packaging Applications.” IMAPSource Proceedings 2017 (DPC): 1–22. https://doi.org/10.4071/2017DPC-WP1_Presentation3.
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