Bell, Rosemary, Joseph Lachowski, Mitsuru Haga, Inho Lee, Regina Cho, Matthew Thorseth, Jonathan Prange, et al. 2017. “Integration of Chemically Amplified Photoresist and High-Speed Copper Plating Products for Advanced Packaging Applications.”
IMAPSource Proceedings 2017 (DPC): 1–22.
https://doi.org/10.4071/2017DPC-WP1_Presentation3.