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Device Packaging Conference Presentations
Vol. 2017, Issue DPC, 2017
January 01, 2017 EDT
Speed and Accuracy Optimization for Fan-Out Die Placement
Tom Strothmann
,
Fan-out
Die placement
Cost reduction
•
https://doi.org/10.4071/2017DPC-WP2_Presentation3
IMAPSource Conference Papers
Strothmann, Tom. 2017. “Speed and Accuracy Optimization for Fan-Out Die Placement.”
IMAPSource Proceedings
2017 (DPC): 1–24.
https://doi.org/10.4071/2017DPC-WP2_Presentation3
.
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