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Device Packaging Conference Presentations
Vol. 2022, Issue DPC, 2022December 13, 2023 EDT

Direct Digital Manufacturing (DDM) Workflow for Printed Circuit Structures (PCS)

C. Mike Newton, Anand Kulkarni, Jason Benoit, Kyle Stoodt,
Printed Circuit StructuresPCSAdditive Manufacturing
https://doi.org/10.4071/001c.91173
IMAPSource Conference Papers
Newton, C. Mike, Anand Kulkarni, Jason Benoit, and Kyle Stoodt. 2023. “Direct Digital Manufacturing (DDM) Workflow for Printed Circuit Structures (PCS).” IMAPSource Proceedings 2022 (DPC): 790–826. https:/​/​doi.org/​10.4071/​001c.91173.
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