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Device Packaging Conference Presentations
Vol. 2022, Issue DPC, 2022November 10, 2023 EDT

Advanced Packaging: Enabling Moore’s Law’s Next Frontier Through Heterogeneous Integration

Raja Swaminathan,
chipletsMoore's Lawmodular architecture2.5D bridge
https://doi.org/10.4071/001c.90014
IMAPSource Conference Papers
Swaminathan, Raja. 2023. “Advanced Packaging: Enabling Moore’s Law’s Next Frontier Through Heterogeneous Integration.” IMAPSource Proceedings 2022 (DPC): 1–37. https:/​/​doi.org/​10.4071/​001c.90014.
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