ISSN 2380-4505
Articles in Vol. 2022, Issue DPC, 2022
Vol. 2022, Issue DPC, 2022
- The Grinding and Polishing Technology for Various MaterialsBob PintoPeter ClayfieldTakeru Inoue
- Solder Flux Evolution for Heterogeneous IntegrationEvan Griffith
- Mask-less Laser Direct Imaging & Adaptive Patterning for Fan-Out Heterogeneous IntegrationClifford SandstromTim Olson
- Liquid Metal Embedded Elastomers (LMEEs) as TIM1 with Highly Reliable & Extremely Low Thermal Resistance PerformanceNavid KazemVivek SinghPhil MarzolfJeff GelormeCarmel Majidi
- Laser Processing of Polyimide and Molybdenum Substrates for Extreme Environment ElectronicsSherman PeekMichael Hamilton
- Key Highlights from iNEMI 5G ProjectMichael Hill
- Inkjet Printing for Semiconductor PackagingJoost Hermans
- Influence of Rigid Carrier Substrates & its Release Layer on Ultra Fine Pitch chip last FO-WLPsYoshinori MatsuuraVivek B. Dutta
- Industry Challenges for Low Loss MeasurementsSay PhommakesoneUrmi Ray
- Immersion Tin Plating Enabling Reliable Wettable Flanks on QFN PackagesArjan HovestadTarun BasuChris Scanlan
- Hybrid Bonding for the Next Generation of High -Performance DevicesLaura Mirkarimi
- How to Tailor Immersion Tin Plating for IC Substrate ApplicationsBritta SchafstellerGustavo RamosHubertus Mertens
- High-throughput Printing of Micro and Nanoscale Interconnects, and Passive and Active Electronics Elements for Heterogeneous Integration and Advanced Packaging ApplicationsAhmed Busnaina
- High-density Fan-Out Chip on Substrate using M-Series (TM) and Adaptive Patterning® TechnologyRobin DavisBenedict San JoseJohn HuntChia-Pin Chen
- Heterogeneous Integration with 3D PackagingRahul AgarwalPatrick ChengPriyal ShahBrett WilkersonRaja SwaminathanJohn Wuu
- FOWLP Thermal Debonding: Easing Manufacturing ConstraintsDebbie Claire Sanchez
- Electrochemical Plating System Development of Nanotwinned Cu for Multiple WLP FeaturesJianwen Han
- EMI Shielding for System in Package Using Spray Coating and Silver Particle-Free InkSima HannaniMelbs LemieuxGarret McKerricher
- Designing Silicon Interposers for 2.5/3DIC Heterogeneous Integration - Meeting Foundry and OSAT RequirementsChris ConeJamie Metcalfe
- Back End Commonality for Advanced Packaging: Large Form Factor ProjectKirk WheelerSteve AndersonChetan HarshaAntoine PharamondNeil RossUrmi Ray
- Advanced Packaging: Enabling Moore's Law's Next Frontier Through Heterogeneous IntegrationRaja Swaminathan
- Addressing Challenges in Dual Sided SiP Thermal BudgetHanwen Zhang
- Sustainment of Printed Hybrid Electronics: Reliability and Repairability StudiesBeihan ZhaoChristopher RisoDavid LeslieAbhijit DasguptaSiddhartha DasJason FleischerDaniel Hines
- State of The Art (SOTA) Heterogeneous Intergrated Packaging (SHIP) ProgramDarren Crum
- Reshoring Advanced Packaging to Enable Modernization ActivitiesTom Smelker
- Photo-Imageable Dielectrics Enabling Structured MEMS and 2.5D / 3D Bonding SystemsDavid DanzaColin HayesKevin WangGreg ProkopowiczPaul BerryMasaki KondoMichael Gallagher
- P-WLCSP: 6-Side Protected WLCSPDoug HacklerEd Prack
- More than Moore with Silicon Photonics Chiplets in Package (SCIP)Vivek RaghunathanSukeshwar KannanHan Peng GohReza Sharifi
- Market & Technology Trends for the Fanout and 2.5D/3D Packaging TechnologySantosh Kumar
- Laser-Based Additive Nanomanufacturing: Rigid to Flexible SubstratesZabihollah AhmadiMasoud Mahjouri-Samani
- Keys to Successful and Stable On-Shore Packaging and Advanced Packaging Defense Industrial BaseJim Will
- Improving Reliability of Fan -Out Wafer Level Package Through Doping of Lead-Free Solder BallsB. RiederW. HartnerW. YuanG. HaubnerM. NiessnerJ. AltmannB. Zhang
- IMAPS 2022 Conference Qorvo SHIP-RFTed Jones
- Heterogeneous Integration of Chiplets, Lego-like IP for More than MooreKeith Felton
- FOWLP and Flip Chip Cost Comparison: Impact of the Supply Chain CrunchAmy P. Lujan
- Establishing a Packaging Ecosystem for GlobalFoundries Leadership Silicon Photonics Wafers –2022 viewDaniel Berger
- Domestic Advanced Packaging for Hi-Rel Microelectronics: The Future is NowJeremy Adams
- Direct Digital Manufacturing (DDM) Workflow for Printed Circuit Structures (PCS)C. Mike NewtonAnand KulkarniJason BenoitKyle Stoodt
- Design and Analysis Challenges of 3D Multi-Chiplet Heterogenous ArchitecturesJohn Park
- Advanced Packaging Technology for High Density Silicon Photonics Transceiver EnginesPeter De Dobbelaere
- Advanced Packaging Capabilities at IntelJohn Sotir
- Advanced Fanout Embedded Bridge Packaging Technology for Chiplets IntegrationLihong Cao
- Additively Manufactured Wireless Sensors for Rugged IoT, Structural Health Monitoring, Smart Agriculture and Smart Cities ApplicationsManos M. Tentzeris
Hermans, Joost. 2023. “Inkjet Printing for Semiconductor Packaging.” IMAPSource Proceedings 2022 (DPC): 971–98. https://doi.org/10.4071/001c.90145.