ISSN 2380-4505
Vol. 2023, Issue DPC, 2023December 01, 2023 EDT
SMART 3D Manufacturing of Printed Electronics
SMART 3D Manufacturing of Printed Electronics
Articles in Vol. 2023, Issue DPC, 2023
Vol. 2023, Issue DPC, 2023
- Using M-Series with Adaptive Patterning to shrink PCB systems into System-In-PackagesJustin LockeRobin Davis
- Universal Chiplet Interconnect Express Г (UCIeГ)Vik Chaudhry
- iNEMI MAESTRO: Glass Substrates for mmWave/sub-THz ApplicationsPaul BallentineShelby Nelson
- Warpage and Reliability Study of Large Size XDFOI(TM) FO-MCM fcBGADanfeng YangNokibul IslamAllen XuCoco XuYaojian Lin
- Validating Flip Chip Package Models Through Experimental Deflection MeasurementsKevin CoxJason KrantzMatt BordenSteven Tonthat
- Understanding Warpage Behavior on Different Handling Platforms of FOWLPDebbie Claire SanchezAshish SutariyaBhaumi PanchalWenxuan SongRonny WagnerSai Marlakunta
- Toward Thinner and Higher Heat Dissipation Advanced Chip Embedded Power Supply Module PackagingKatsuhiro TakaoAtsushi KurohaMichihito KawadaIchiro KonoTakashi SuzukiYoshiaki Aizawa
- Thin and Ultra-thin Sidewall Protected P-WLCSPDoug HacklerEd Prack
- Thermo-compression Bonding Assembly TechnologyBob Chylak
- The Evolution of Moore's Law Through Chipletized ArchitecturesVic MedranoTony Trinh
- Squaring Off with M-Series Fan-Out TechnologyCliff SandstromBenedict San JoseTim OlsonJen-Kuang FangPing-Feng YangSheng Feng-HuangPing-Ching Shen
- Solutions for Low Cost, Near Hermetic Air Cavity PackagesKaren LynchDon Zyriek
- Semiconductor R&D Path to ManufacturingVic Narusis
- Scaling Interconnect Densities Meeting the Growing Demand for Chiplet IntegrationRobin DavisTim Olson
- SMART 3D Manufacturing of Printed ElectronicsC. Mike NewtonAnand KulkarniJason BenoitEmily SassanoKyle Stoodt
- Reliability Investigations in Printed Electronic AssembliesAbhijit DasguptaBeihan Zhao
- RF Packaging and Design for Development of High Performance 5G mmWave ModulesIvan NdipThi Huyen LeKavin MurugesanUwe MaaßMichael KaiserMartin Schneider-Ramelow
- Processing and Reliability Testing of a Copper Pressure Sinter Paste for use in High Power Module, Die Attach ApplicationsDean Payne
- Performance Enablement Through VIPack FOPOP for Mobile and NetworkingMark GerberMeiju LuVincent LinChienfan Chen
- Optimizing New Power Switch TechnologySam Sadri
- OSAT Production Testing of 5G, Power Discretes & 3D packaged ICsVineet Pancholi
- Novel Low Df Thermosetting Film and Photo Imageable FilmMeiten Koh
- Novel IR Laser Debonding for Heterogeneous and 3D IntegrationThomas UhrmannPeter UrbanMarkus WimplingerBoris PovazayJulian BravinBernd Thallner
- New Momentum in Semiconductor: Impact of EcosystemsSylvie Joly
- NIST Advanced Manufacturing Technology (MfgTech) RoadmapUrmi Ray
- Micr -Transfer Printing for Efficient 3DHI of 100-300mm Wafers and Glass PanelsBob ConnerBill BatchelorDavid Gomez
- Low Loss/Low CTE Semiconductor Carrier Packaging Thin Core MaterialCaleb Ancharski
- Liquid Metal Embedded Elastomers as High-performance S-TIM ReplacementsKeyton Feller
- Leveraging AI and ML to Augment Advanced Semiconductor Packaging Design and VerificationKeith FeltonJohn FergusonPer Viklund
- Incorporating Hierarchical Construction for Advanced IC PackagingChris ConeEd Hudson
- Implementation of Applied R&D and European Activities in the "Chips Act Age“Peter Ramm
- Hybrid Bond Interconnect and Advanced Packaging SolutionsThomas WorkmanDominik SuwitoLaura MirkarimiGill FountainGuilian GaoJeremy TheilBongsub LeeCyprian UzohOliver ZhaoKM Bang
- High Speed Copper Plating Process for IC SubstrateSean FleurielConfesol RodriguezKesheng FengLinyu PanVictoire Kayempi TshitengeRobert MoonDolores CruzJon Hander
- High -yield Fabrication of Thin Glass InterposersShelby F. NelsonDavid H. LevyKyle LiddlePatrick Borrelli
- Hermetic Package for MEMS MirrorDavide RottaMarco ChiesaAina SerranoMarco Del SartoLuca MaggiAmedeo MaiernaAntonella Bogoni
- Glass Package and Through Glass Via (TGV) for MEMSAric Shorey
- Glass Devices for Next-Generation Packaging and RF Signal ConditioningJeb H. Flemming
- Glass Core Substrates Opportunities for CHIPS and MMI -from Research to ManufacturingMadhavan SwaminathanWilliam E. Leonhard
- Fine-Feature Additively Dry Printed Passive Wireless Sensor TagZabihollah AhmadiMasoud Mahjouri-SamaniRobert N. Dean
- Extending Moore’s Law with Integrated Photonics (and Packaging)Nicholas Harris
- Enabling Co-Design of 3D Heterogeneous PackagesJohn Park
- Driving Adoption of Advanced IC Packaging in Automotive ApplicationsBassam Ziadeh
- Development of Electronic Packages with Integrated Environmental MitigationCarl RuddArtie BondBrian EnglishBenoit HamlinMark AdamsRobert Dean
- Defluxing of Copper Pillar Bumped Flip ChipsRavi ParthasarathyUmut Tosun
- D2W Hybrid Bonding Using High Accuracy Carrier Solutions for 3D System IntegrationThomas UhrmannJürgen BurggrafMariana PiresChun Ho FanHoi Ping NgMing Li
- Cost Analysis of Fan-out Processes for Chiplet PackagingAmy Lujan
- Chiplets Integration: Simplifying the LandscapeMike KellyDave HinerGeroge Scott
- Chip to Wafer Hybrid Bonding Development for High Volume ManufacturingJonathan Abdilla
- CU Wirebond Technology in 16FFC High Performance Automotive Radar Processor with IR Drop Reduction MethodologyTu Anh TranJasmine LimYK AuMJ SongMollie Benson
- Assembly Solutions for Cost-Effective Heterogeneous Integration with Disparate Die TypesGlenn Farris
- Advanced Thermal Interface Materials: Assembly and Integration for System in PackageKevin Brenner
- Advanced Test Technologies for Heterogeneous & 2.5D/3D PackagingMarc HutnerKen Butler
- Advanced Packaging Materials and Open Innovation at ResonacHidenori Abe
- Advanced IC Substrates for Heterogeneous IntegrationMarkus LeitgebVenkata MokkapatiRozalia Beica
- Advanced Glass Carriers for Buildup Structure Warp Control and Wafer Ultra-thinningJay ZhangAndy TengChristina YuJulia Brueckner
- Addressing Advanced IC Substrate Deformation and Pattern Distortion Using an Extremely Large Exposure Field Fine Fine-Resolution Lithography SystemJohn Chang
- A Novel 2D/3D X-ray Microscopy Alignment and Inspection Solution for Thermocompression Bonding (TCB) in a Highly Integrated Flip Chip Fan-Out Wafer Level Package (FO-WLP)David TaraciHolger BlankMartin KainzJohannes Ruoff
- A Framework for Reshoring of the Outsourced Assembly and Test (OSAT) Industry to the USScott Sikorski
- 6G Hardware System Design and Packaging NeedsP M RajSatheesh VenkatakrishnanJohn Volakis
- 5G Electronics: Bridging the Measurement ChallengesLucas Enright
- 4D mmW/5G Metasurfaces and Wireless Sensors Combining Additive Manufacturing, Morphing and ML TechnologiesM. M. TentzerisK. Hu
Newton, C. Mike, Anand Kulkarni, Jason Benoit, Emily Sassano, and Kyle Stoodt. 2023. “SMART 3D Manufacturing of Printed Electronics.” IMAPSource Proceedings 2023 (DPC): 547–83. https://doi.org/10.4071/001c.90777.