ISSN 2380-4505
Vol. 2023, Issue DPC, 2023November 16, 2023 EDT
iNEMI MAESTRO: Glass Substrates for mmWave/sub-THz Applications
iNEMI MAESTRO: Glass Substrates for mmWave/sub-THz Applications
Articles in Vol. 2023, Issue DPC, 2023
Vol. 2023, Issue DPC, 2023
- Using M-Series with Adaptive Patterning to shrink PCB systems into System-In-PackagesJustin LockeRobin Davis
- Universal Chiplet Interconnect Express Г (UCIeГ)Vik Chaudhry
- iNEMI MAESTRO: Glass Substrates for mmWave/sub-THz ApplicationsPaul BallentineShelby Nelson
- Warpage and Reliability Study of Large Size XDFOI(TM) FO-MCM fcBGADanfeng YangNokibul IslamAllen XuCoco XuYaojian Lin
- Validating Flip Chip Package Models Through Experimental Deflection MeasurementsKevin CoxJason KrantzMatt BordenSteven Tonthat
- Understanding Warpage Behavior on Different Handling Platforms of FOWLPDebbie Claire SanchezAshish SutariyaBhaumi PanchalWenxuan SongRonny WagnerSai Marlakunta
- Toward Thinner and Higher Heat Dissipation Advanced Chip Embedded Power Supply Module PackagingKatsuhiro TakaoAtsushi KurohaMichihito KawadaIchiro KonoTakashi SuzukiYoshiaki Aizawa
- Thin and Ultra-thin Sidewall Protected P-WLCSPDoug HacklerEd Prack
- Thermo-compression Bonding Assembly TechnologyBob Chylak
- The Evolution of Moore's Law Through Chipletized ArchitecturesVic MedranoTony Trinh
- Squaring Off with M-Series Fan-Out TechnologyCliff SandstromBenedict San JoseTim OlsonJen-Kuang FangPing-Feng YangSheng Feng-HuangPing-Ching Shen
- Solutions for Low Cost, Near Hermetic Air Cavity PackagesKaren LynchDon Zyriek
- Semiconductor R&D Path to ManufacturingVic Narusis
- Scaling Interconnect Densities Meeting the Growing Demand for Chiplet IntegrationRobin DavisTim Olson
- SMART 3D Manufacturing of Printed ElectronicsC. Mike NewtonAnand KulkarniJason BenoitEmily SassanoKyle Stoodt
- Reliability Investigations in Printed Electronic AssembliesAbhijit DasguptaBeihan Zhao
- RF Packaging and Design for Development of High Performance 5G mmWave ModulesIvan NdipThi Huyen LeKavin MurugesanUwe MaaßMichael KaiserMartin Schneider-Ramelow
- Processing and Reliability Testing of a Copper Pressure Sinter Paste for use in High Power Module, Die Attach ApplicationsDean Payne
- Performance Enablement Through VIPack FOPOP for Mobile and NetworkingMark GerberMeiju LuVincent LinChienfan Chen
- Optimizing New Power Switch TechnologySam Sadri
- OSAT Production Testing of 5G, Power Discretes & 3D packaged ICsVineet Pancholi
- Novel Low Df Thermosetting Film and Photo Imageable FilmMeiten Koh
- Novel IR Laser Debonding for Heterogeneous and 3D IntegrationThomas UhrmannPeter UrbanMarkus WimplingerBoris PovazayJulian BravinBernd Thallner
- New Momentum in Semiconductor: Impact of EcosystemsSylvie Joly
- NIST Advanced Manufacturing Technology (MfgTech) RoadmapUrmi Ray
- Micr -Transfer Printing for Efficient 3DHI of 100-300mm Wafers and Glass PanelsBob ConnerBill BatchelorDavid Gomez
- Low Loss/Low CTE Semiconductor Carrier Packaging Thin Core MaterialCaleb Ancharski
- Liquid Metal Embedded Elastomers as High-performance S-TIM ReplacementsKeyton Feller
- Leveraging AI and ML to Augment Advanced Semiconductor Packaging Design and VerificationKeith FeltonJohn FergusonPer Viklund
- Incorporating Hierarchical Construction for Advanced IC PackagingChris ConeEd Hudson
- Implementation of Applied R&D and European Activities in the "Chips Act Age“Peter Ramm
- Hybrid Bond Interconnect and Advanced Packaging SolutionsThomas WorkmanDominik SuwitoLaura MirkarimiGill FountainGuilian GaoJeremy TheilBongsub LeeCyprian UzohOliver ZhaoKM Bang
- High Speed Copper Plating Process for IC SubstrateSean FleurielConfesol RodriguezKesheng FengLinyu PanVictoire Kayempi TshitengeRobert MoonDolores CruzJon Hander
- High -yield Fabrication of Thin Glass InterposersShelby F. NelsonDavid H. LevyKyle LiddlePatrick Borrelli
- Hermetic Package for MEMS MirrorDavide RottaMarco ChiesaAina SerranoMarco Del SartoLuca MaggiAmedeo MaiernaAntonella Bogoni
- Glass Package and Through Glass Via (TGV) for MEMSAric Shorey
- Glass Devices for Next-Generation Packaging and RF Signal ConditioningJeb H. Flemming
- Glass Core Substrates Opportunities for CHIPS and MMI -from Research to ManufacturingMadhavan SwaminathanWilliam E. Leonhard
- Fine-Feature Additively Dry Printed Passive Wireless Sensor TagZabihollah AhmadiMasoud Mahjouri-SamaniRobert N. Dean
- Extending Moore’s Law with Integrated Photonics (and Packaging)Nicholas Harris
- Enabling Co-Design of 3D Heterogeneous PackagesJohn Park
- Driving Adoption of Advanced IC Packaging in Automotive ApplicationsBassam Ziadeh
- Development of Electronic Packages with Integrated Environmental MitigationCarl RuddArtie BondBrian EnglishBenoit HamlinMark AdamsRobert Dean
- Defluxing of Copper Pillar Bumped Flip ChipsRavi ParthasarathyUmut Tosun
- D2W Hybrid Bonding Using High Accuracy Carrier Solutions for 3D System IntegrationThomas UhrmannJürgen BurggrafMariana PiresChun Ho FanHoi Ping NgMing Li
- Cost Analysis of Fan-out Processes for Chiplet PackagingAmy Lujan
- Chiplets Integration: Simplifying the LandscapeMike KellyDave HinerGeroge Scott
- Chip to Wafer Hybrid Bonding Development for High Volume ManufacturingJonathan Abdilla
- CU Wirebond Technology in 16FFC High Performance Automotive Radar Processor with IR Drop Reduction MethodologyTu Anh TranJasmine LimYK AuMJ SongMollie Benson
- Assembly Solutions for Cost-Effective Heterogeneous Integration with Disparate Die TypesGlenn Farris
- Advanced Thermal Interface Materials: Assembly and Integration for System in PackageKevin Brenner
- Advanced Test Technologies for Heterogeneous & 2.5D/3D PackagingMarc HutnerKen Butler
- Advanced Packaging Materials and Open Innovation at ResonacHidenori Abe
- Advanced IC Substrates for Heterogeneous IntegrationMarkus LeitgebVenkata MokkapatiRozalia Beica
- Advanced Glass Carriers for Buildup Structure Warp Control and Wafer Ultra-thinningJay ZhangAndy TengChristina YuJulia Brueckner
- Addressing Advanced IC Substrate Deformation and Pattern Distortion Using an Extremely Large Exposure Field Fine Fine-Resolution Lithography SystemJohn Chang
- A Novel 2D/3D X-ray Microscopy Alignment and Inspection Solution for Thermocompression Bonding (TCB) in a Highly Integrated Flip Chip Fan-Out Wafer Level Package (FO-WLP)David TaraciHolger BlankMartin KainzJohannes Ruoff
- A Framework for Reshoring of the Outsourced Assembly and Test (OSAT) Industry to the USScott Sikorski
- 6G Hardware System Design and Packaging NeedsP M RajSatheesh VenkatakrishnanJohn Volakis
- 5G Electronics: Bridging the Measurement ChallengesLucas Enright
- 4D mmW/5G Metasurfaces and Wireless Sensors Combining Additive Manufacturing, Morphing and ML TechnologiesM. M. TentzerisK. Hu
Ballentine, Paul, and Shelby Nelson. 2023. “iNEMI MAESTRO: Glass Substrates for mmWave/Sub-THz Applications.” IMAPSource Proceedings 2023 (DPC): 220–40. https://doi.org/10.4071/001c.90224.