A Novel 2D/3D X-ray Microscopy Alignment and Inspection Solution for Thermocompression Bonding (TCB) in a Highly Integrated Flip Chip Fan-Out Wafer Level Package (FO-WLP)

Taraci, David, Holger Blank, Martin Kainz, and Johannes Ruoff. 2023. “A Novel 2D/3D X-Ray Microscopy Alignment and Inspection Solution for Thermocompression Bonding (TCB) in a Highly Integrated Flip Chip Fan-Out Wafer Level Package (FO-WLP).” IMAPSource Proceedings 2023 (DPC): 892–923. https:/​/​doi.org/​10.4071/​001c.90690.