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ISSN 2380-4505
Device Packaging Conference Presentations
Vol. 2023, Issue DPC, 2023December 01, 2023 EDT

Driving Adoption of Advanced IC Packaging in Automotive Applications

Bassam Ziadeh,
advanced IC packagingautomotive applicationsautomotive semiconductor sourcing
https://doi.org/10.4071/001c.90780
IMAPSource Conference Papers
Ziadeh, Bassam. 2023. “Driving Adoption of Advanced IC Packaging in Automotive Applications.” IMAPSource Proceedings 2023 (DPC): 1064–86. https:/​/​doi.org/​10.4071/​001c.90780.

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