Vol. 2023, Issue DPC, 2023December 07, 2023 EDT
CU Wirebond Technology in 16FFC High Performance Automotive Radar Processor with IR Drop Reduction Methodology
CU Wirebond Technology in 16FFC High Performance Automotive Radar Processor with IR Drop Reduction Methodology
Tran, Tu Anh, Jasmine Lim, YK Au, MJ Song, and Mollie Benson. 2023. “CU Wirebond Technology in 16FFC High Performance Automotive Radar Processor with IR Drop Reduction Methodology.” IMAPSource Proceedings 2023 (DPC): 1322–47. https://doi.org/10.4071/001c.90953.