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Device Packaging Conference Presentations
Vol. 2023, Issue DPC, 2023November 16, 2023 EDT

Micr -Transfer Printing for Efficient 3DHI of 100-300mm Wafers and Glass Panels

Bob Conner, Bill Batchelor, David Gomez,
Micro-Transfer Printing3D heterogeneous integrationdisruptive innovation3DIC
https://doi.org/10.4071/001c.90228
IMAPSource Conference Papers
Conner, Bob, Bill Batchelor, and David Gomez. 2023. “Micr -Transfer Printing for Efficient 3DHI of 100-300mm Wafers and Glass Panels.” IMAPSource Proceedings 2023 (DPC): 281–330. https:/​/​doi.org/​10.4071/​001c.90228.
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