ISSN 2380-4505
Vol. 2019, Issue HiTen, 2019July 01, 2019 EDT
Fully Integrated Sensor Electronics for Inductive Proximity Switches Operating up to 250 °C
Fully Integrated Sensor Electronics for Inductive Proximity Switches Operating up to 250 °C
Sebastian Braun, Norbert Kordas, Alexander Utz, Holger Kappert, Rainer Kokozinski,
Articles in Vol. 2019, Issue HiTen, 2019
Vol. 2019, Issue HiTen, 2019
- Modular Desktop Platform for High-Temperature Characterization and Test up to 300 °CTom ReinholdBjörn BieskeGeorg GläserMichael Meister
- An Advanced Extreme Environment Wireless Telemetry System for Turbine Blade InstrumentationJohn R. FraleyAlan MantoothSajib RoyRobert MurphreeAffan AbassiAnand KulkarniJoshua McConkey
- High Temperature Memory Design, Implementation, and Characterization in 1μm SiC CMOS TechnologyAffan AbbasiRobert MurphreeSajib RoyMarvin SuggsJohn FraleyH. Alan MantoothJia DiTobias Erlbacher
- Bonding strength of Cu/Cu joints using sintering process of micro-sized Cu particles for high-temperature applicationHiroshi NishikawaXiangdong Liu
- Investigation of phase change materials for efficient thermal management of electronic modulesA. NovikovJ. MaxaM. NowottnickM. HeimannK. Jarchoff
- Moisture-resistant sealing materials for downhole HPHT electrical feedthrough packageHua XiaNelson SettlesDavid DeWire
- High Temperature – High Voltage Solid Electrolytic Tantalum CapacitorsY. FreemanP. Lessner
- Stackable SiC Embedded Ceramic Packages for High Voltage and High Temperature Power Electronics ApplicationsHoang Linh BachDaniel DirksenChristoph BlechingerTobias Maximilian EndresChristoph Friedrich BayerAndreas SchletzMartin März
- Resistors for High Temperature ApplicationsTom Morris
- Comparative study of how additives affect sintered silver microstructure in die-attach applicationsMing LoSeyed Amir PaknejadHarry BorrillWan K. KongAddo Addo-KwabenaMohamed SaidouneChris PowleyNaim KapadiaYang ZuoSamjid H. Mannan
- A modular application specific active test environment for high-temperature wafer test up to 300 °CMichael MeisterMarco Reinhard
- Characteristics of Organic-Based Thermal Interface Materials Suitable for High Temperature OperationBaron WangAndrea S. ChenRandy H.Y. Lo
- Miniature Power Sources for High Temperature Industrial SensorsBrian E. HaydenLouise M.V. TurnerRobert NobleLaura PerkinsDenis Pasero
- Parametric study of electronics components joining using reactive films for high temperature applicationsRabih KhazakaDonatien MartineauToni YoussefThanh Long LeStéphane Azzopardi
- Study of Thermal Stress in Nano Silver Bonded Silicon Substrates for High Temperature ApplicationsG.D. LiuC.H. Wang
- Considerations for Sintering in High Temperature ElectronicsThomas Krebs
- Fabrication of highly reliable joint based on Cu@Ni@Sn double-layer powder for high temperature applicationHongyan XuYaochun ShenYihua HuJianqiang LiJu Xu
- The Impact of AuSn Preforms Thickness on Solder Joint ReliabilityBernard Leavitt
- Origami for Tight Spaces - 3D 250C PCB Assemblies for Control SystemsPiers TremlettPhil ElliotPablo Tena
- Fully Integrated Sensor Electronics for Inductive Proximity Switches Operating up to 250 °CSebastian BraunNorbert KordasAlexander UtzHolger KappertRainer Kokozinski
- On-turbine multisensors based on Hybrid Ceramic Manufacturing TechnologySteffen ZiescheAdrian GoldbergUwe PartschHolger KappertHeidrun KindMirko AdenFalk Naumann
- Improved sinterability of particles to substrates by surface modifications on substrate metallizationSri Krishna BhogarajuOmid MokhtariJacopo PascucciFosca ContiGordon Elger
Braun, Sebastian, Norbert Kordas, Alexander Utz, Holger Kappert, and Rainer Kokozinski. 2019. “Fully Integrated Sensor Electronics for Inductive Proximity Switches Operating up to 250 °C.” IMAPSource Proceedings 2019 (HiTen): 112–16. https://doi.org/10.4071/2380-4491.2019.HiTen.000112.