ISSN 2380-4505
Vol. 2019, Issue HiTen, 2019July 01, 2019 EDT
High Temperature – High Voltage Solid Electrolytic Tantalum Capacitors
High Temperature – High Voltage Solid Electrolytic Tantalum Capacitors
Y. Freeman, P. Lessner,
Articles in Vol. 2019, Issue HiTen, 2019
Vol. 2019, Issue HiTen, 2019
- Modular Desktop Platform for High-Temperature Characterization and Test up to 300 °CTom ReinholdBjörn BieskeGeorg GläserMichael Meister
- An Advanced Extreme Environment Wireless Telemetry System for Turbine Blade InstrumentationJohn R. FraleyAlan MantoothSajib RoyRobert MurphreeAffan AbassiAnand KulkarniJoshua McConkey
- High Temperature Memory Design, Implementation, and Characterization in 1μm SiC CMOS TechnologyAffan AbbasiRobert MurphreeSajib RoyMarvin SuggsJohn FraleyH. Alan MantoothJia DiTobias Erlbacher
- Bonding strength of Cu/Cu joints using sintering process of micro-sized Cu particles for high-temperature applicationHiroshi NishikawaXiangdong Liu
- Investigation of phase change materials for efficient thermal management of electronic modulesA. NovikovJ. MaxaM. NowottnickM. HeimannK. Jarchoff
- Moisture-resistant sealing materials for downhole HPHT electrical feedthrough packageHua XiaNelson SettlesDavid DeWire
- High Temperature – High Voltage Solid Electrolytic Tantalum CapacitorsY. FreemanP. Lessner
- Stackable SiC Embedded Ceramic Packages for High Voltage and High Temperature Power Electronics ApplicationsHoang Linh BachDaniel DirksenChristoph BlechingerTobias Maximilian EndresChristoph Friedrich BayerAndreas SchletzMartin März
- Resistors for High Temperature ApplicationsTom Morris
- Comparative study of how additives affect sintered silver microstructure in die-attach applicationsMing LoSeyed Amir PaknejadHarry BorrillWan K. KongAddo Addo-KwabenaMohamed SaidouneChris PowleyNaim KapadiaYang ZuoSamjid H. Mannan
- A modular application specific active test environment for high-temperature wafer test up to 300 °CMichael MeisterMarco Reinhard
- Characteristics of Organic-Based Thermal Interface Materials Suitable for High Temperature OperationBaron WangAndrea S. ChenRandy H.Y. Lo
- Miniature Power Sources for High Temperature Industrial SensorsBrian E. HaydenLouise M.V. TurnerRobert NobleLaura PerkinsDenis Pasero
- Parametric study of electronics components joining using reactive films for high temperature applicationsRabih KhazakaDonatien MartineauToni YoussefThanh Long LeStéphane Azzopardi
- Study of Thermal Stress in Nano Silver Bonded Silicon Substrates for High Temperature ApplicationsG.D. LiuC.H. Wang
- Considerations for Sintering in High Temperature ElectronicsThomas Krebs
- Fabrication of highly reliable joint based on Cu@Ni@Sn double-layer powder for high temperature applicationHongyan XuYaochun ShenYihua HuJianqiang LiJu Xu
- The Impact of AuSn Preforms Thickness on Solder Joint ReliabilityBernard Leavitt
- Origami for Tight Spaces - 3D 250C PCB Assemblies for Control SystemsPiers TremlettPhil ElliotPablo Tena
- Fully Integrated Sensor Electronics for Inductive Proximity Switches Operating up to 250 °CSebastian BraunNorbert KordasAlexander UtzHolger KappertRainer Kokozinski
- On-turbine multisensors based on Hybrid Ceramic Manufacturing TechnologySteffen ZiescheAdrian GoldbergUwe PartschHolger KappertHeidrun KindMirko AdenFalk Naumann
- Improved sinterability of particles to substrates by surface modifications on substrate metallizationSri Krishna BhogarajuOmid MokhtariJacopo PascucciFosca ContiGordon Elger
Freeman, Y., and P. Lessner. 2019. “High Temperature – High Voltage Solid Electrolytic Tantalum Capacitors.” IMAPSource Proceedings 2019 (HiTen): 91–98. https://doi.org/10.4071/2380-4491.2019.HiTen.000091.