ISSN 2380-4505
Vol. 2019, Issue HiTen, 2019July 01, 2019 EDT
Stackable SiC Embedded Ceramic Packages for High Voltage and High Temperature Power Electronics Applications
Stackable SiC Embedded Ceramic Packages for High Voltage and High Temperature Power Electronics Applications
Hoang Linh Bach, Daniel Dirksen, Christoph Blechinger, Tobias Maximilian Endres, Christoph Friedrich Bayer, Andreas Schletz, Martin März,
Bach, Hoang Linh, Daniel Dirksen, Christoph Blechinger, Tobias Maximilian Endres, Christoph Friedrich Bayer, Andreas Schletz, and Martin März. 2019. “Stackable SiC Embedded Ceramic Packages for High Voltage and High Temperature Power Electronics Applications.” IMAPSource Proceedings 2019 (HiTen): 28–33. https://doi.org/10.4071/2380-4491.2019.HiTen.000028.