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High Temperature Conference Papers
Vol. 2019, Issue HiTen, 2019July 01, 2019 EDT

Comparative study of how additives affect sintered silver microstructure in die-attach applications

Ming Lo, Seyed Amir Paknejad, Harry Borrill, Wan K. Kong, Addo Addo-Kwabena, Mohamed Saidoune, Chris Powley, Naim Kapadia, Yang Zuo, Samjid H. Mannan,
Electronic PackagingSinteringBondingAgingDie AttachNanoscale SilverHigh Temperature
https://doi.org/10.4071/2380-4491.2019.HiTen.000061
IMAPSource Conference Papers
Lo, Ming, Seyed Amir Paknejad, Harry Borrill, Wan K. Kong, Addo Addo-Kwabena, Mohamed Saidoune, Chris Powley, Naim Kapadia, Yang Zuo, and Samjid H. Mannan. 2019. “Comparative Study of How Additives Affect Sintered Silver Microstructure in Die-Attach Applications.” IMAPSource Proceedings 2019 (HiTen): 61–65. https:/​/​doi.org/​10.4071/​2380-4491.2019.HiTen.000061.
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