ISSN 2380-4505
Vol. 2018, Issue HiTEC, 2018May 01, 2018 EDT
High heat-density SiC heater chip for thermal characterization of high temperature packaging
High heat-density SiC heater chip for thermal characterization of high temperature packaging
Naoki Wakasugi, Shijo Nagao, Kim Dongjin, Katsuaki Suganuma,
Articles in Vol. 2018, Issue HiTEC, 2018
Vol. 2018, Issue HiTEC, 2018
- Environmentally Hardening IC Die Previously Assembled in Plastic Packages through Die Removal, Bond Pad Replating and Reassembly into Hermetic PackagesCharlie BeeboutErick M. Spory
- Influence of Initial Shear Strength on Time-to-Failure of Copper (Cu) Wire Bonds in Thermal Aging ConditionSubramani ManoharanChandradip PatelStevan HunterPatrick McCluskey
- Monitoring Magma Under Volcanoes: The Future Of Eruption Forecasting And Geothermal EnergyJohn Eichelberger
- Highly Reliable Pressure-Less Silver Sintering JointsSihai ChenWilliam ShambachChristine LaBarberaNing-Cheng Lee
- Mitigation of High Temperature Environments on Electrical DisconnectsKenneth P. Dowhower
- Organic Hybrids for Circuit Assemblies – Initial environmental testing of a low cost alternative to ceramic substrate based assembliesMartin WickhamKate ClaytonAna RobadorChristine Thorogood
- Identification of thermo-mechanical fatigue fracture location by transient thermal analysis for high-temperature operating SiC power module assembled with ZnAl eutectic solderFumiki KatoHiroki TakahashiHidekazu TanisawaKenichi KouiShinji SatoYoshinori MurakamiHiroshi NakagawaHiroshi YamaguchiHiroshi Sato
- New Capacitance Sensor PerformanceDavid Andrew
- US Geothermal Funding Outlook (Reducing Cost Barriers for HT SOI Reservoir Monitoring Systems)Randy A. Normann
- Digital Logic Synthesis for 470 Celsius Silicon Carbide ElectronicsN. ChiolinoA. M. FrancisJ. HolmesM. Barlow
- From Chips to Modules: Tackling the High Temperature Design ChallengePierre DelatteZlatan Gradincic
- Co-optimized Reliability and Parasitic inductance in Small Footprint Vertical Silicon Carbide MOSFETM. MontazeriS. SealA. WallaceA. MantoothD. Huitink
- Sixty Earth-Days Test of a Prototype Pt/HTCC Alumina Package in Simulated Venus EnvironmentLiangyu ChenPhilip G. NeudeckRoger D. MeredithDorothy LukcoDavid J. SpryLeah M. NakleyKyle G. PhillipsGlenn M. BeheimGary W. Hunter
- Conductive Fusion Technology Advanced Die Attach Materials for High Power ApplicationsMaciej PatelkaNicholas KrascoSho IkedaToshiyuki SatoMiguel GoniElbara ZiadeAaron J. Schmidt
- Yearlong 500 °C Operational Demonstration of Up-scaled 4H-SiC JFET Integrated CircuitsPhilip G. NeudeckDavid J. SpryMichael J. KrasowskiNorman F. ProkopGlenn M. BeheimLiang-Yu ChenCarl W. Chang
- Robust Reliability of Ceramic Capacitors for Power ElectronicsAbhijit GuravJohn BultitudeJohn McConnellReggie Phillips
- A 300°C High Reliability HALT/HAST Screening/Sorting Procedure for Ceramic CapacitorsHarold L. Snyder
- Configurable Digital Logic for Extreme EnvironmentsRichard Rea
- High heat-density SiC heater chip for thermal characterization of high temperature packagingNaoki WakasugiShijo NagaoKim DongjinKatsuaki Suganuma
- Analog and Logic High Temperature Integrated Circuits Based on Enhancement Mode Planar SiC JFETsPeter AlexandrovMatt O'GradyNeil MerrettLaura Walter
- Novel solder-mesh interconnection design for power module applicationsAdrian LisHiroaki TatsumiTomoki MatsudaTomokazu SanoYoshihiro KashibaAkio Hirose
- Lifetime and Failure Modes of High Temperature SOI ProductsDerek MaxwellMarshall SoaresMatt Coreless
- Performance Test Results of a Precision Data Acquisition and Control Platform for 200°C+ High Temperature EnvironmentsJeff WatsonMaithil PachchigarRoss BannatyneClay MerrittChristopher ConradGlenn SmollingerEarle Drack
- Modelling the Influence of Conformal Coatings on Thermo-Mechanical Fatigue of Solder Interconnects in Electronic PackagesMaxim SerebreniRoss WilcoxonF. Patrick McCluskey
Wakasugi, Naoki, Shijo Nagao, Kim Dongjin, and Katsuaki Suganuma. 2018. “High Heat-Density SiC Heater Chip for Thermal Characterization of High Temperature Packaging.” IMAPSource Proceedings 2018 (HiTEC): 93–97. https://doi.org/10.4071/2380-4491-2018-HiTEN-000093.