This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search
  • LinkedIn (opens in a new tab)
  • RSS feed (opens a modal with a link to feed)

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:5765/feed
ISSN 2380-4505
High Temperature Conference Papers
Vol. 2018, Issue HiTEC, 2018May 01, 2018 EDT

Modelling the Influence of Conformal Coatings on Thermo-Mechanical Fatigue of Solder Interconnects in Electronic Packages

Maxim Serebreni, Ross Wilcoxon, F. Patrick McCluskey,
Conformal coatingsolder fatigueBGAQFNDigital Image CorrelationGlass transition temperature
https://doi.org/10.4071/2380-4491-2018-HiTEN-000007
IMAPSource Conference Papers
Serebreni, Maxim, Ross Wilcoxon, and F. Patrick McCluskey. 2018. “Modelling the Influence of Conformal Coatings on Thermo-Mechanical Fatigue of Solder Interconnects in Electronic Packages.” IMAPSource Proceedings 2018 (HiTEC): 7–14. https:/​/​doi.org/​10.4071/​2380-4491-2018-HiTEN-000007.

View more stats

Powered by Scholastica, the modern academic journal management system