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Device Packaging Conference Presentations
Vol. 2017, Issue DPC, 2017
January 01, 2017 EDT
THE CHANGING LANDSCAPE IN THE BACK END
Brandon Prior
,
supply chain
packaging
semiconductor
sensor
•
https://doi.org/10.4071/2017DPC-GBC_Presentation4
IMAPSource Conference Papers
Prior, Brandon. 2017. “THE CHANGING LANDSCAPE IN THE BACK END.”
IMAPSource Proceedings
2017 (DPC): 1–20.
https://doi.org/10.4071/2017DPC-GBC_Presentation4
.
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