ISSN 2380-4505
Vol. 2023, Issue HiTEC, CICMT, Power, 2023October 17, 2023 EDT
Next Generation High Powered RF and Optical Packages
Next Generation High Powered RF and Optical Packages
Articles in Vol. 2023, Issue HiTEC, CICMT, Power, 2023
Vol. 2023, Issue HiTEC, CICMT, Power, 2023
- Shadow masks as an alternative method to lithography for the structuring of thin film layers on LTCC substratesHeike BartschNesrine JaziriKonrad JaekelNorayr NessimianJens Müller
- AuSn Preform Thickness’s Effect on Thermal Management in Semiconductor Laser ApplicationsJenny GallerySamuel Lytwynec
- Investigations of selected influencing process factors for transient liquid phase soldering (TLPS) as a die-attach method for automotive power modulesBettina OttingerJoshua HolverscheidSebastian KönigAnnette BrunnerDr. Lars MüllerDr. Christian GothProf. Dr. Jörg Franke
- Reducing High Temperature System Development Cycle Time and Cost with Additively Manufactured ConnectorsMatthew BakowskiWalter NiblockJacob Kupernik,A. Matt Francis
- Investigation and Evaluation of High-Temperature Encapsulation Materials for Power Module ApplicationsBenjamin LyonChristina DiMarino
- Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power ModulesDavid HuitinkWhit VinsonCollin RubyImam Al RaziDavid Agogo-MawuliAlan MantoothYarui Peng
- An update on high temperature tantalum capacitor technologyD. WestR. DemckoR. MessinaA. Stanziola
- Gate Driver Design in 180 nm SOI CMOS Process for Heterogeneous Integration Inside SiC Power ModuleAsif FaruqueAyesha HassanRiya PaulH. Alan Mantooth
- Recent Progress in Extreme Environment Durable SiC JFET-R Integrated Circuit TechnologyPhilip G. NeudeckDavid J. SpryMichael J. KrasowskiCarl W. ChangJosé M. GonzalezSrihari RajgopalNorman F. ProkopLawrence C. GreerDorothy LukcoShamir Maldonado-RiveraChristina M. Adams
- Additive Prototyping for Rapid Circuit and Interface Development at 200°C+Jacob KupernikMatthew BakowskiBrandon DyerWalter NiblockA. Matt Francis
- Next Generation High Powered RF and Optical PackagesRamesh KothandapaniTan Sin LiTee Zhen WeiNoel DeLeonChen WangChristopher Johnson
Kothandapani, Ramesh, Tan Sin Li, Tee Zhen Wei, Noel DeLeon, Chen Wang, and Christopher Johnson. 2023. “Next Generation High Powered RF and Optical Packages.” IMAPSource Proceedings 2023 (HiTEC, CICMT, Power): 54–58. https://doi.org/10.4071/001c.89110.