ISSN 2380-4505
Vol. 2023, Issue HiTEC, CICMT, Power, 2023October 17, 2023 EDT
Investigation and Evaluation of High-Temperature Encapsulation Materials for Power Module Applications
Investigation and Evaluation of High-Temperature Encapsulation Materials for Power Module Applications
Articles in Vol. 2023, Issue HiTEC, CICMT, Power, 2023
Vol. 2023, Issue HiTEC, CICMT, Power, 2023
- Shadow masks as an alternative method to lithography for the structuring of thin film layers on LTCC substratesHeike BartschNesrine JaziriKonrad JaekelNorayr NessimianJens Müller
- AuSn Preform Thickness’s Effect on Thermal Management in Semiconductor Laser ApplicationsJenny GallerySamuel Lytwynec
- Investigations of selected influencing process factors for transient liquid phase soldering (TLPS) as a die-attach method for automotive power modulesBettina OttingerJoshua HolverscheidSebastian KönigAnnette BrunnerDr. Lars MüllerDr. Christian GothProf. Dr. Jörg Franke
- Reducing High Temperature System Development Cycle Time and Cost with Additively Manufactured ConnectorsMatthew BakowskiWalter NiblockJacob Kupernik,A. Matt Francis
- Investigation and Evaluation of High-Temperature Encapsulation Materials for Power Module ApplicationsBenjamin LyonChristina DiMarino
- Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power ModulesDavid HuitinkWhit VinsonCollin RubyImam Al RaziDavid Agogo-MawuliAlan MantoothYarui Peng
- An update on high temperature tantalum capacitor technologyD. WestR. DemckoR. MessinaA. Stanziola
- Gate Driver Design in 180 nm SOI CMOS Process for Heterogeneous Integration Inside SiC Power ModuleAsif FaruqueAyesha HassanRiya PaulH. Alan Mantooth
- Recent Progress in Extreme Environment Durable SiC JFET-R Integrated Circuit TechnologyPhilip G. NeudeckDavid J. SpryMichael J. KrasowskiCarl W. ChangJosé M. GonzalezSrihari RajgopalNorman F. ProkopLawrence C. GreerDorothy LukcoShamir Maldonado-RiveraChristina M. Adams
- Additive Prototyping for Rapid Circuit and Interface Development at 200°C+Jacob KupernikMatthew BakowskiBrandon DyerWalter NiblockA. Matt Francis
- Next Generation High Powered RF and Optical PackagesRamesh KothandapaniTan Sin LiTee Zhen WeiNoel DeLeonChen WangChristopher Johnson
Lyon, Benjamin, and Christina DiMarino. 2023. “Investigation and Evaluation of High-Temperature Encapsulation Materials for Power Module Applications.” IMAPSource Proceedings 2023 (HiTEC, CICMT, Power): 21–26. https://doi.org/10.4071/001c.89104.