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High Temperature Conference Papers
Vol. 2023, Issue HiTEC, CICMT, Power, 2023October 17, 2023 EDT

Additive Prototyping for Rapid Circuit and Interface Development at 200°C+

Jacob Kupernik, Matthew Bakowski, Brandon Dyer, Walter Niblock, A. Matt Francis,
Additive manufacturinghigh-temperature electronicsreliability testingquick turn manufacturing
https://doi.org/10.4071/001c.89109
IMAPSource Conference Papers
Kupernik, Jacob, Matthew Bakowski, Brandon Dyer, Walter Niblock, and A. Matt Francis. 2023. “Additive Prototyping for Rapid Circuit and Interface Development at 200°C+.” IMAPSource Proceedings 2023 (HiTEC, CICMT, Power): 49–53. https:/​/​doi.org/​10.4071/​001c.89109.
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