ISSN 2380-4505
Vol. 2023, Issue HiTEC, CICMT, Power, 2023October 17, 2023 EDT
Investigations of selected influencing process factors for transient liquid phase soldering (TLPS) as a die-attach method for automotive power modules
Investigations of selected influencing process factors for transient liquid phase soldering (TLPS) as a die-attach method for automotive power modules
Ottinger, Bettina, Joshua Holverscheid, Sebastian König, Annette Brunner, Dr. Lars Müller, Dr. Christian Goth, and Prof. Dr. Jörg Franke. 2023. “Investigations of Selected Influencing Process Factors for Transient Liquid Phase Soldering (TLPS) as a Die-Attach Method for Automotive Power Modules.” IMAPSource Proceedings 2023 (HiTEC, CICMT, Power): 11–15. https://doi.org/10.4071/001c.89095.