ISSN 2380-4505
Vol. 2013, Issue HITEN, 2013January 01, 2013 EDT
High Temperature Reliability Investigations up to 350 °C of Gate Oxide Capacitors realized in a Silicon-on-Insulator CMOS-Technology
High Temperature Reliability Investigations up to 350 °C of Gate Oxide Capacitors realized in a Silicon-on-Insulator CMOS-Technology
K. Grella, S. Dreiner, H. Vogt, U. Paschen,
Articles in Vol. 2013, Issue HITEN, 2013
Vol. 2013, Issue HITEN, 2013
- Experimental Investigation of Electro-thermal Stress Impact on SiC-BJTs Electrical CharacteristicsThibaut ChaillouxCyril CalvezPascal BevilacquaDominique PlansonDominique Tournier
- Packaging technologies for high temperature control electronicsConor SlaterRadisav CojbasicThomas MaederYusuf LeblebiciPeter Ryser
- Reliability of Au-Ti for High Temperature Termination on Ferrite LTCC InductorsJames GalipeauMatt Gerlach
- Precise Chip Joint Method with Sub-micron Au Particle for High-density SiC Power Module Operating at High TemperatureFumiki KatoFengqun LangSimanjorang RejekiHiroshi NakagawaHiroshi YamaguchiHiroshi Sato
- Evaluation of Refractory Metals for Package Level Interconnection in a Harsh EnvironmentRiko I MadeEric Jian Rong PhuaKey Wen TanWei Chuan OngClare Guanqi HuangHock Guan OngVivek Chidambaram NachiappanChee Cheong WongChen ZhongChee Lip Gan
- High temperature, Smart Power Module for aircraft actuatorsKhalil El FalahiStanislas HascoëtCyril ButtayPascal BevilacquaLuong-Viet PhungDominique TournierBruno AllardDominique Planson
- Performance and Reliability Characterization of 1200 V Silicon Carbide Power MOSFETs at High TemperaturesR. J. KaplarD. R. HughartS. AtcittyJ. D. FlickerS. DasGuptaM. J. Marinella
- 230C Hermetically Sealed SMD Tantalum CapacitorsT. ZednicekM. BilerJ. PetrzilekI. PinwillR. Faltus
- KEMET SMD Film Capacitors for High Temperature ApplicationsLuca CaliariPaola BettacchiEvangelista BoniDavide MontanariArrigo GamberiniLuigi BarbieriFrancesco Bergamaschi
- The European SEEL (Solutions for energy efficient lighting) project: High temperature electronics for LED-lighting architecturesS. HabenichtH.J. FunkeD. GruberD. OelgeschlägerO. SchumacherR. GehnS. WalczykA. MavinkurveTh. ReinersR. FiederlingM. VoglJ. SchugH. WillwohlJ. BlandinM. HutterC. EhrhardtH. Oppermann
- LT-TLPS Die Attach for High Temperature Electronic PackagingHannes GreveF. Patrick McCluskey
- Novel encapsulation materials for High Pressure-High Temperature (HPHT) applicationsEric Jian Rong PhuaMing LiuRiko I MadeLiying ZhangChee Cheong WongZhong ChenMin Woo RheeXiao HuChee Lip Gan
- Effectiveness of Barrier Layer Metallisations in Long Term High Temperature Endurance Tests on Wire Bond InterconnectionsS T RichesC JohnstonA Lui
- High-Temperature Characterization and Comparison of 1.2 kV SiC Power Semiconductor DevicesChristina DiMarinoZheng ChenDushan BoroyevichRolando BurgosPaolo Mattavelli
- Advanced Applications of High Temperature MagneticsJohn R. FraleyEdgar CilioBryon Western
- Lead-free Solder Attach for 200°C ApplicationsZhenzhen ShenKun FangMike HamiltonR. Wayne JohnsonErica SnipesMichael Bozack
- Evaluation of Pressure Free Nanoparticle Sintered Silver Die Attach on Silver and Gold SurfacesG. LewisG. DumasS. H. Mannan
- Demonstration of a 300°C Capable Directional Drilling Steering Tool (DM300)D MacGugan
- The Thermal Integrity of Integrated GaN Power ModulesJ. RobertsT. MacElweeL. Yushyna
- Multi-bit memory cell using long-range non-anchored actuation for high temperature applicationsMehrdad ElyasiChengkuo LeeCheng-Yu HsiehDim-Lee Kwong
- Enhanced High Temperature Performance of PD-SOI MOSFETs in Analog Circuits Using Reverse Body BiasingAlexander SchmidtHolger KappertRainer Kokozinski
- A 4H-SiC Bipolar Technology for High-temperature Integrated CircuitsL. LanniB. G. MalmC.-M. ZetterlingM. Östling
- Reliability of wire-bonded electronic devices in combined high temperature and vibrational environmentsM. MirgkizoudiC. LiuP. ConwayS. Riches
- Precision Analog Signal Conditioning Semiconductors for Operation in Very High Temperature EnvironmentsMichael ArkinJeff WatsonMichael SiuMichael Cusack
- Communication system for down-hole measurement tools based on real-time SNR characterization in coaxial cable used as communication channelRito MijarezDavid PascacioRicardo GuevaraOlimpia PachecoCarlos TelloJoaquín Rodríguez
- A High Temperature, Frequency Output Silicon Temperature SensorShane RoseMark Hahn
- Reliability of SiC Digital Telemetry Circuits on AlN SubstrateReza GhandiCheng-Po ChenLiang YinRich SaiaTammy JohnsonPeter SandvikKun FangR. Wayne Johnson
- Advanced Ceramic Capacitor Solutions for High Temperature ApplicationsAbhijit GuravXilin XuJim MageePaul StaubliJohn BultitudeTravis Ashburn
- High Temperature Reliability Investigations up to 350 °C of Gate Oxide Capacitors realized in a Silicon-on-Insulator CMOS-TechnologyK. GrellaS. DreinerH. VogtU. Paschen
- High Temperature 256Kbit (32Kbit × 8) HTEEPROM Reliability TestingJoe G. GuimontBruce W. Ohme
- 1200 V SiC Schottky Rectifiers optimized for ≥ 250 °C operation with low junction capacitanceRanbir SinghSiddarth Sundaresan
- High Temperature Characterization and Reliability Data of Key Semiconductor Technologies for Power and Control DevicesBrian WilkinsonKent WaltersPaul Ellerman
- Silicon Capacitors with extremely high stability and reliability ideal for high temperature applicationsCatherine BunelLaurent Lengignon
- POL and LDO for Harsh Environment ApplicationsRamesh KhannaSrinivasan Venkataraman
- Long Term Demonstrated Performance Characteristics for Improved High Temperature Ceramic Capacitors Intended for Use in Extreme, Harsh EnvironmentsMustafa A. SyammachMustapha HabibiFauzi A. Syammach
- DIP Test Socket Characterization for 300°CDavid ShaddockLiang YinZhenzhen ShenZhangming ZhouR. Wayne Johnson
- A High Temperature, Fast Switching SiC Multi-chip Power Module (MCPM) for High Frequency (> 500 kHz) Power Conversion ApplicationsZ. ColeB. S. PassmoreB. WhitakerA. BarkleyT. McNuttA. B. Lostetter
- A 250°C ASIC TechnologyLynn Reed
- Robust True LDO Linear Voltage Regulator and Digitally Trimmable Buffered Precision Voltage Reference for High-Temperature, Low-Voltage ApplicationsYoann DuséFabien LaplaceNicolas JoubertXavier MontmayeurNoureddine ZitouniSebastien VieussesGregory ThepautArnaud AnotaGonzalo Picun
Grella, K., S. Dreiner, H. Vogt, and U. Paschen. 2013. “High Temperature Reliability Investigations up to 350 °C of Gate Oxide Capacitors Realized in a Silicon-on-Insulator CMOS-Technology.” IMAPSource Proceedings 2013 (HITEN): 116–21. https://doi.org/10.4071/HITEN-TA13.