ISSN 2380-4505
Vol. 2013, Issue HITEN, 2013January 01, 2013 EDT
Communication system for down-hole measurement tools based on real-time SNR characterization in coaxial cable used as communication channel
Communication system for down-hole measurement tools based on real-time SNR characterization in coaxial cable used as communication channel
Rito Mijarez, David Pascacio, Ricardo Guevara, Olimpia Pacheco, Carlos Tello, Joaquín Rodríguez,
Articles in Vol. 2013, Issue HITEN, 2013
Vol. 2013, Issue HITEN, 2013
- Experimental Investigation of Electro-thermal Stress Impact on SiC-BJTs Electrical CharacteristicsThibaut ChaillouxCyril CalvezPascal BevilacquaDominique PlansonDominique Tournier
- Packaging technologies for high temperature control electronicsConor SlaterRadisav CojbasicThomas MaederYusuf LeblebiciPeter Ryser
- Reliability of Au-Ti for High Temperature Termination on Ferrite LTCC InductorsJames GalipeauMatt Gerlach
- Precise Chip Joint Method with Sub-micron Au Particle for High-density SiC Power Module Operating at High TemperatureFumiki KatoFengqun LangSimanjorang RejekiHiroshi NakagawaHiroshi YamaguchiHiroshi Sato
- Evaluation of Refractory Metals for Package Level Interconnection in a Harsh EnvironmentRiko I MadeEric Jian Rong PhuaKey Wen TanWei Chuan OngClare Guanqi HuangHock Guan OngVivek Chidambaram NachiappanChee Cheong WongChen ZhongChee Lip Gan
- High temperature, Smart Power Module for aircraft actuatorsKhalil El FalahiStanislas HascoëtCyril ButtayPascal BevilacquaLuong-Viet PhungDominique TournierBruno AllardDominique Planson
- Performance and Reliability Characterization of 1200 V Silicon Carbide Power MOSFETs at High TemperaturesR. J. KaplarD. R. HughartS. AtcittyJ. D. FlickerS. DasGuptaM. J. Marinella
- 230C Hermetically Sealed SMD Tantalum CapacitorsT. ZednicekM. BilerJ. PetrzilekI. PinwillR. Faltus
- KEMET SMD Film Capacitors for High Temperature ApplicationsLuca CaliariPaola BettacchiEvangelista BoniDavide MontanariArrigo GamberiniLuigi BarbieriFrancesco Bergamaschi
- The European SEEL (Solutions for energy efficient lighting) project: High temperature electronics for LED-lighting architecturesS. HabenichtH.J. FunkeD. GruberD. OelgeschlägerO. SchumacherR. GehnS. WalczykA. MavinkurveTh. ReinersR. FiederlingM. VoglJ. SchugH. WillwohlJ. BlandinM. HutterC. EhrhardtH. Oppermann
- LT-TLPS Die Attach for High Temperature Electronic PackagingHannes GreveF. Patrick McCluskey
- Novel encapsulation materials for High Pressure-High Temperature (HPHT) applicationsEric Jian Rong PhuaMing LiuRiko I MadeLiying ZhangChee Cheong WongZhong ChenMin Woo RheeXiao HuChee Lip Gan
- Effectiveness of Barrier Layer Metallisations in Long Term High Temperature Endurance Tests on Wire Bond InterconnectionsS T RichesC JohnstonA Lui
- High-Temperature Characterization and Comparison of 1.2 kV SiC Power Semiconductor DevicesChristina DiMarinoZheng ChenDushan BoroyevichRolando BurgosPaolo Mattavelli
- Advanced Applications of High Temperature MagneticsJohn R. FraleyEdgar CilioBryon Western
- Lead-free Solder Attach for 200°C ApplicationsZhenzhen ShenKun FangMike HamiltonR. Wayne JohnsonErica SnipesMichael Bozack
- Evaluation of Pressure Free Nanoparticle Sintered Silver Die Attach on Silver and Gold SurfacesG. LewisG. DumasS. H. Mannan
- Demonstration of a 300°C Capable Directional Drilling Steering Tool (DM300)D MacGugan
- The Thermal Integrity of Integrated GaN Power ModulesJ. RobertsT. MacElweeL. Yushyna
- Multi-bit memory cell using long-range non-anchored actuation for high temperature applicationsMehrdad ElyasiChengkuo LeeCheng-Yu HsiehDim-Lee Kwong
- Enhanced High Temperature Performance of PD-SOI MOSFETs in Analog Circuits Using Reverse Body BiasingAlexander SchmidtHolger KappertRainer Kokozinski
- A 4H-SiC Bipolar Technology for High-temperature Integrated CircuitsL. LanniB. G. MalmC.-M. ZetterlingM. Östling
- Reliability of wire-bonded electronic devices in combined high temperature and vibrational environmentsM. MirgkizoudiC. LiuP. ConwayS. Riches
- Precision Analog Signal Conditioning Semiconductors for Operation in Very High Temperature EnvironmentsMichael ArkinJeff WatsonMichael SiuMichael Cusack
- Communication system for down-hole measurement tools based on real-time SNR characterization in coaxial cable used as communication channelRito MijarezDavid PascacioRicardo GuevaraOlimpia PachecoCarlos TelloJoaquín Rodríguez
- A High Temperature, Frequency Output Silicon Temperature SensorShane RoseMark Hahn
- Reliability of SiC Digital Telemetry Circuits on AlN SubstrateReza GhandiCheng-Po ChenLiang YinRich SaiaTammy JohnsonPeter SandvikKun FangR. Wayne Johnson
- Advanced Ceramic Capacitor Solutions for High Temperature ApplicationsAbhijit GuravXilin XuJim MageePaul StaubliJohn BultitudeTravis Ashburn
- High Temperature Reliability Investigations up to 350 °C of Gate Oxide Capacitors realized in a Silicon-on-Insulator CMOS-TechnologyK. GrellaS. DreinerH. VogtU. Paschen
- High Temperature 256Kbit (32Kbit × 8) HTEEPROM Reliability TestingJoe G. GuimontBruce W. Ohme
- 1200 V SiC Schottky Rectifiers optimized for ≥ 250 °C operation with low junction capacitanceRanbir SinghSiddarth Sundaresan
- High Temperature Characterization and Reliability Data of Key Semiconductor Technologies for Power and Control DevicesBrian WilkinsonKent WaltersPaul Ellerman
- Silicon Capacitors with extremely high stability and reliability ideal for high temperature applicationsCatherine BunelLaurent Lengignon
- POL and LDO for Harsh Environment ApplicationsRamesh KhannaSrinivasan Venkataraman
- Long Term Demonstrated Performance Characteristics for Improved High Temperature Ceramic Capacitors Intended for Use in Extreme, Harsh EnvironmentsMustafa A. SyammachMustapha HabibiFauzi A. Syammach
- DIP Test Socket Characterization for 300°CDavid ShaddockLiang YinZhenzhen ShenZhangming ZhouR. Wayne Johnson
- A High Temperature, Fast Switching SiC Multi-chip Power Module (MCPM) for High Frequency (> 500 kHz) Power Conversion ApplicationsZ. ColeB. S. PassmoreB. WhitakerA. BarkleyT. McNuttA. B. Lostetter
- A 250°C ASIC TechnologyLynn Reed
- Robust True LDO Linear Voltage Regulator and Digitally Trimmable Buffered Precision Voltage Reference for High-Temperature, Low-Voltage ApplicationsYoann DuséFabien LaplaceNicolas JoubertXavier MontmayeurNoureddine ZitouniSebastien VieussesGregory ThepautArnaud AnotaGonzalo Picun
Mijarez, Rito, David Pascacio, Ricardo Guevara, Olimpia Pacheco, Carlos Tello, and Joaquín Rodríguez. 2013. “Communication System for Down-Hole Measurement Tools Based on Real-Time SNR Characterization in Coaxial Cable Used as Communication Channel.” IMAPSource Proceedings 2013 (HITEN): 174–83. https://doi.org/10.4071/HITEN-TP14.