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Device Packaging Conference Presentations
Vol. 2015, Issue DPC, 2015January 01, 2015 EDT

Reliability of Cu Wirebonded ICs for Automotive Applications

Jim McLeish, Greg Caswell, Randy Schueller,
Cu Wirebondingautomotive applicationreliability
https://doi.org/10.4071/Poster_DfR1
IMAPSource Conference Papers
McLeish, Jim, Greg Caswell, and Randy Schueller. 2015. “Reliability of Cu Wirebonded ICs for Automotive Applications.” IMAPSource Proceedings 2015 (DPC): 1721–52. https:/​/​doi.org/​10.4071/​Poster_DfR1.
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