Vol. 2015, Issue DPC, 2015January 01, 2015 EDT
Advanced High Density Trench Capacitor Substrate Technology for 3D heterogeneous stacks with outstanding performances.
Advanced High Density Trench Capacitor Substrate Technology for 3D heterogeneous stacks with outstanding performances.
Catherine Bunel, Franck Murray,
Bunel, Catherine, and Franck Murray. 2015. “Advanced High Density Trench Capacitor Substrate Technology for 3D Heterogeneous Stacks with Outstanding Performances.” IMAPSource Proceedings 2015 (DPC): 109–42. https://doi.org/10.4071/2015DPC-ta12.