ISSN 2380-4505
Vol. 2015, Issue DPC, 2015January 01, 2015 EDT
Silicon-Embedded RF Micro-Inductors for Ultra-Compact RF Subsystems
Silicon-Embedded RF Micro-Inductors for Ultra-Compact RF Subsystems
Florian Herrault, M. Yajima, M. Chen, C. McGuire, A. Margomenos,
Articles in Vol. 2015, Issue DPC, 2015
Vol. 2015, Issue DPC, 2015
- Silicon Wafer Integrated Fan-out TechnologyCurtis ZwengerRon HuemoellerJinHan KimDongJean KimWonChul DoSeongMin Seo
- Scanned Mask Imaging Ablative DPSS UV Laser Process for 2μm L/S RDLDavid MylesDavid MilneJonathan D Shephard
- A Module-on-module Manufacturing Process and the Study of its Warpage and Signal IntegrityThomas WangJames LinTony ChengPing-Chi HongAlbert LinHarrison Chang
- The discrete vacuum packaging of IR-microbolometersLuca Mauri
- Multi3D Manufacturing: 3D Printing of Geometrically-Complex Aerospace Structures with Embedded ElectronicsEric MacDonalddDavid EspalinSlade CulpRyan Wicker
- BGA Board Level Reliability Analysis & OptimizationBetty Yeung
- Design of Filled One Step Chip Attach Materials (OSCA) for Conventional Mass Reflow Processing: Curing Kinetics and Solder Reflow AspectsDaniel DuffyHemal BhavsarLin XinJean LiuBruno Tolla
- Study of chip stack process and electrical property for 3D-LSIToshiya Akamatsu
- A Cost and Yield Analysis of Wafer-to-wafer BondingAmy PaleskoChet Palesko
- A PCB Technology Electrical Conductivity Sensor for the Measurement of Saltwater ContaminationRobert N. DeanFrank WernerMark Adams
- Temporary Bonding of Wafers, Displays, and ComponentsJohn MooreJared PettitAlex BrewerAlman Law
- Development of TSV Reveal Process Using Very Fine Si/Cu Grinding and Metal Contamination RemovalNaoya WatanabeMasahiro AoyagiDaisuke KatagawaTsubasa BandohTakahiko MitsuiEiichi Yamamoto
- Advanced Silicon Interposer for High density and High Integration Electronic PackagesSATORU KUMOCHISumio KoiwaKosuke SuzukiYoshitaka Fukuoka
- Next generation thin film polymers for WLP applications and their mechanical and electrical characterizationMarkus WoehrmannM. ToepperH. WalterK.-D. Lang
- Characterization of a Semiconductor Packaging System utilizing Through Glass Via (TGV) TechnologyTim MobleyRoupen KeusseyanTim LeClairKonstantin YamnitskiyRegi Nocon
- Integrated Localized MicroCooling Using High-Displacement Piezoelectric ActuatorsMichael KranzJanice BoothVicki LeFevreTracy HudsonBrian EnglishMichael Whitley
- Optical Cavity Interrogation for MEMS AccelerometersMichael KranzTracy HudsonBrian GranthamMichael Whitley
- Reliability of Cu Wirebonded ICs for Automotive ApplicationsJim McLeishGreg CaswellRandy Schueller
- Bend testing of micro-scale bulk metal specimens using a chip-scale test instrumentLi-Anne LiewDavid T. ReadNicholas Barbosa
- SiP Technology for Wireless Module MiniaturizationBenny Kuo
- COMPARISON OF FOWLP VS QFN PACKAGE FROM THERMAL ASPECTQun Wan
- FEA INVESTIGATION OF FACTORS AFFECTING BUMP FATIGUE LIFEMingji WangWei Li
- Shrinking Package Footprint by Embedding Top-Side Real Estate Using Core-to-Core JoiningCatherine ShearerKen HolcombJim Haley
- A Kinetic Monte Carlo Approach to Study Transport in Amorphous SiliconPradyumna MuralidharanDragica VasileskaStephen M. Goodnick
- Technologies for Wafer Level MEMS Capping based on Permanent and Temporary Wafer BondingKai ZoschkeKlaus-Dieter Lang
- The European 3D Heterogeneous Integration Platform (e-BRAINS) - a Particular Focus on Reliability and Low-Temperature Processes for 3D Integrated Sensor SystemsPeter RammArmin KlumppAlan MathewsonKafil M. RazeebReinhard Pufall
- Embedded solutions: Fan-out and Embedded Dies Packages market and technology trendsJerome AZEMARRozalia BEICAThibault BUISSONAndrej IVANCOVICAmandine PIZZAGALLI
- Advances in Fine Pitch Off-Chip Interconnections Through the Use of a Novel Surface FinishArnd KilianGustavo RamosRick NicholsRobin TaylorVanessa SmetNinad ShahaneTingChia HuangRao Tummala
- Advanced High Density Trench Capacitor Substrate Technology for 3D heterogeneous stacks with outstanding performances.Catherine BunelFranck Murray
- A Microcontroller Approach to Measuring Transmissibility of MEMS DevicesChong LiYixuan WuHaoyue YangLuke L. JenkinsRobert N. DeanGeorge T. Flowers
- Advanced Electronic Packaging Options for Miniaturization of Complex Medical DevicesSusan BagenRavi SubrahmanyanRuben PerroneDaniel Schulze
- SiPs in the medical domain and in the defense and industrial domain produced with WDoDTM technologyPascal COUDERCJérôme NOIRAY
- Self Priming Low Stress Aqueous Developable Benzocyclobutene (AD-BCB) Photodielectric Materials for Advanced Wafer Level PackagingHua DongGreg ProkopowiczBob BarrJoe LachowskiJeff CalvertMike GallagherTina AoudeRosemary BellSue McNamaraMasaki KondohJoon-Seok OhDavid LouksJong-Uk Kim
- Material and Process Developments for Robust and High Reliability Glass Wafers for 2.5D PackagingRoupen KeusseyanTim Mobley
- Silicon-Embedded RF Micro-Inductors for Ultra-Compact RF SubsystemsFlorian HerraultM. YajimaM. ChenC. McGuireA. Margomenos
- Electroplating with Dielectric BridgesGene StoutDoug ScottAnthony CurtisGuy BurgessTheodore G. Tessier
- Heterogeneous Integration and Micromachining Technologies for Terahertz Devices and ComponentsRobert M. WeikleN. Scott BarkerArthur W. LichtenbergerMatthew F. BauwensNaser Alijabbari
- The Increasing Challenges in Testing MEMSRichard Chrusciel
- Micro-Electro-Mechanical System for Measuring Mechanical Properties of Cell AggregatesNegar MoghimiSabrina JedlickaSvetlana Tatic-Lucic
- Cu electroplating chemistry and process enabling rapid TSV filling with long bath lifeMatthew A ThorsethLuis GomezMark ScalisiBryan LiebMark LefebvreJeff CalvertDave EricksonBob MikkolaBridger HoernerJames Burnham
- Highly tunable Mn-doped PZT thin films for integrated RF devicesWarda BenhadjalaFlorence SonneratJennifer GuillaumeChristel DieppedalePhilippe RenauxGwenaël Le RhunHenri SibuetChristophe Billard
- Next-Generation Copper, Nickel and Lead-Free Metallization Products for Next-Generation Devices and ApplicationsJonathan PrangeYi QinMatthew ThorsethInho LeeMasaaki ImanariYil-Hak LeeJulia WoertinkMark LefebvreWataru TachikawaJianwei DongJeffrey Calvert
- Anaerobic adhesive jetting for micro-electronics packaging applicationsHanzhuang LiangFloriana SuriawidjajaMichael Szuch
- Problems and promises of sapphire micromachiningSyed Sajid AhmadFred Haring
- Improved RF Metamaterial Band-Pass Filter Design Using CSRR Structures on LCP SubstrateChristopher JamesRobert N. Dean
- Design and Fabrication of a PCB MEMS Module With Integrated Switches and Sensor SuiteLi-Anne LiewD. BotelerC.Y. LinN. MarsigliaY.C. Lee
- Design and fabrication of MEMS-type compliant overhang flip-chip interconnect for RF applicationsPingye XuMichael C. Hamilton
- Development of 2.5D and 3D IC Fabrication and Assembly TechnologiesGuilian GaoHong ShengSangil LeeBong-Sub LeeScott McGrathLiang WangCharles WoychikCyprian UzohGrant VillavicencioRoseann AlatorreSitaram Arkalgud
- An In Situ Atmospheric Probe for Real Time Weather MonitoringMark L. AdamsAudrey Rose ShaplandMatthew GutierrezEvan Owen
- Enabling Requirements for High Volume Thermo compression BondingTom Strothmann
- Multi Beam Full Cut Dicing of Thin Si IC WafersJeroen van BorkuloRichard van der StamGuido Knippels
- Flexible Hand-Free Microelectronics assembly Line for the Chip and Wire industryPrakash BhartiaJim AngeloniWill Bolinger
- Advancements in Through Glass Via (TGV) TechnologyAric ShoreyRachel LuScott PollardEkatarina KuksenkovaGene Smith
- Thin Wafer Handling Using Mechanical- or Laser-Debondable Temporary AdhesivesDavid FlemingJong-Uk KimJanet OkadaKevin WangMichael GallagherBob BarrJeff CalvertKai ZoschkeMatthias WegnerMichael TöpperThomas RappsTim GriesbachStefan Lutter
- A MEMS Magnetometer Utilizing a NdFeB MagnetJohn J. TatarchukColin B. StevensRobert N. Dean
- 3D MICROSENSOR IMAGING ARRAYS NETWORKSDavid FriesGeran Barton
- Embedded Power Modules – A new approach using Power Core and High Power PCBLars BoettcherLars BoettcherS. KaraszkiewiczD. ManessisA. Ostmann
- Ultralow Residue (ULR) Semiconductor Grade Fluxes for Flip-Chip and MEMs ApplicationsMaria DurhamSzePei LimJason ChouAndy Mackie
- Automate 3D Modeling of Trace and Via StructuresGreg CaswellCraig HillmanNathan BlattauFrank Pitelli NaviusPaul WatersGil Sharon
- System in Package Design Case StudyJames Meyer
- Low Cost Chip Last Fanout Package using Coreless SubstrateScott ChenSimon WangColtrane LeeJohn Hunt
- A Random Stimulation Source for Evaluating MEMS Devices using an Exact Solvable Chaotic OscillatorAubrey N. BealRobert N. Dean
- Magnetic Current Imaging of a TSV short in a 3D ICJan GaudestadAntonio Orozco
Herrault, Florian, M. Yajima, M. Chen, C. McGuire, and A. Margomenos. 2015. “Silicon-Embedded RF Micro-Inductors for Ultra-Compact RF Subsystems.” IMAPSource Proceedings 2015 (DPC): 939–57. https://doi.org/10.4071/2015DPC-tp44.