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Device Packaging Conference Presentations
Vol. 2015, Issue DPC, 2015January 01, 2015 EDT

Multi3D Manufacturing: 3D Printing of Geometrically-Complex Aerospace Structures with Embedded Electronics

Eric MacDonaldd, David Espalin, Slade Culp, Ryan Wicker,
3D Printed Electronics Additive Manufacturing 3D Printing
• https://doi.org/10.4071/2015DPC-ta31
IMAPSource Conference Papers
MacDonaldd, Eric, David Espalin, Slade Culp, and Ryan Wicker. 2015. “Multi3D Manufacturing: 3D Printing of Geometrically-Complex Aerospace Structures with Embedded Electronics.” IMAPSource Proceedings 2015 (DPC): 301–27. https://doi.org/10.4071/2015DPC-ta31.
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