Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:25512/feed
High Temperature Conference Papers
Vol. 2017, Issue HiTEN, 2017July 01, 2017 EDT

Sintered Silver Die Attach with Extreme Thermal Stability for Extreme and Dynamic Environments

Khalid Khtatba, Seyed Amir Paknejad, Ali Mansourian, Samjid H. Mannan,
Electronic PackagingSinteringBondingAgingDie AttachNanoscale SilverHigh Temperature
https://doi.org/10.4071/2380-4491.2017.HiTEN.168
IMAPSource Conference Papers
Khtatba, Khalid, Seyed Amir Paknejad, Ali Mansourian, and Samjid H. Mannan. 2017. “Sintered Silver Die Attach with Extreme Thermal Stability for Extreme and Dynamic Environments.” IMAPSource Proceedings 2017 (HiTEN): 168–76. https:/​/​doi.org/​10.4071/​2380-4491.2017.HiTEN.168.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system