ISSN 2380-4505
Vol. 2017, Issue HiTEN, 2017July 01, 2017 EDT
Development of a Novel Logging Tool for 450°C Geothermal Wells
Development of a Novel Logging Tool for 450°C Geothermal Wells
Jon Vedum, Morten H. Røed, Sigbjørn Kolberg, Magnus Hjelstuen, Anders E. Liverud, Øyvind N. Stamnes,
Articles in Vol. 2017, Issue HiTEN, 2017
Vol. 2017, Issue HiTEN, 2017
- A High Temperature Linear Wideband Power Amplifier for a Downhole Communication SystemS. Reza HiemstraBrannon M. KerriganDong S. Ha
- Effect of isothermal aging at 250 °C on shear strength of joints using Sn-Coated Cu particle paste for high-temperature applicationHiroshi NishikawaXiangdong LiuSiliang He
- Time-efficient sintering processes to attach power devices using nanosilver dry filmJingru DaiJianfeng LiPearl AgyakwaChristopher Mark Johnson
- Evaluation of Thermal Resistance Degradation of SiC Power Module Corresponding to Thermal Cycle TestFumiki KatoHiroki TakahashiHidekazu TanisawaKenichi KouiShinji SatoYoshinori MurakamiHiroshi NakagawaHiroshi YamaguchiHiroshi Sato
- Potential of Zn-Al Solder Alloy for High Temperature SiC Power ModuleHidekazu TanisawaFumiki KatoHiroki TakahashiKenichi KouiShinji SatoYoshinori MurakamiKinuyo WatanabeHiroshi YamaguchiHiroshi Sato
- A High Temperature 4H-SiC Voltage Reference for Depletion Mode GaN-Based CircuitsZiHao ZhangJebreel M. SalemDong Sam Ha
- An Advanced Extreme Environment Wireless Telemetry System for Turbine Blade InstrumentationJohn R. FraleyBrett SparkmanStephen MindenJoshua McConkey
- Design and fabrication of a power Si/SiC LDMOSFET for high temperature applicationsF. LiP.M. GammonC.W. ChanF. GityT. TrajkovicV. KilchytskaV. PathiranaK. Ben AliD. FlandreP.A. MawbyJ.W. Gardner
- Creation of an ARM® Cortex®-M0 microcontroller for high temperature embedded systemsR. BannatyneD. GiffordK. KleinK. McCarvilleC. MerrittS. Neddermeyer
- Development of a Novel Logging Tool for 450°C Geothermal WellsJon VedumMorten H. RøedSigbjørn KolbergMagnus HjelstuenAnders E. LiverudØyvind N. Stamnes
- The Tamessa project: a practical application of a 225°C multilayer PCB/SMT/COB systemPiers R. Tremlett
- Thermal reliability of SiC device with Cu sintering die-attach processed at 250°C in N2 gasShijo NagaoHiroki YoshikawaHirofumi FujitaAkio ShimoyamaShinya SekiHao ZhangKatsuaki Suganuma
- Microstructure stability of TLPS interconnects in high operating temperature applicationsCatherine Shearer
- High Temperature Quadrature Amplitude Modulation over Orthogonal Frequency Division MultiplexingAvery CashionGrzegorz Cieslewki
- A Precision Data Acquisition and Control Platform for 200°C+ High Temperature EnvironmentsJeff WatsonMaithil PachchigarRoss BannatyneClay MerrittChristopher ConradGlenn SmollingerEarle Drack
- SOI Operational Amplifier Applications in 300°C Operating EnvironmentCheng-Po ChenLucian StoicaEmad AndarawisRussell Simpson
- High Temperature, Time Domain Sensor Interface based on Phase ShifterEmna ChabchoubFranck BadetsMohamed MasmoudiPascal NouetFrédérick Mailly
- Effects of Bond Pad Thickness on Shear Strength of Copper Wire BondsSubramani ManoharanChandradip PatelStevan HunterPatrick McCluskey
- Die-Attach Voiding Reduction in Gold Alloy Solder PreformsBernard LeavittAndy C. Mackie
- High-Precision Mixed-Signal Sensor Interface for a Wide Temperature Range [0° – 300°C]Georg GläserDagmar KirstenAndré RichterMarco ReinhardGerrit KroppDirk M. Nuernbergk
- Evaluation of High Temperature Joining Technologies for Semiconductor Die AttachSiyuan QiChris PowleyMaria MirgkizoudiAdele PliscottPeter Collier
- Comparison of a Current Mode Reference Generator vs.a ΔVBE Bandgap Circuit in a 1.0μm Partially-Depleted Silicon-On-Insulator CMOS Process for High Temperature (220 °C) EnvironmentsAlex PikeAdrien CorneFrank BohacRavi Ananth
- A Comparison Between Solders & Transient Liquid Phase Sintered Interconnects in High Temperature Multi-Layer Ceramic CapacitorsJohn BultitudeJohn McConnellLonnie JonesGalen MillerJim MageeAllen TempletonAbhijit GuravReggie Phillips
- Sintered Silver Die Attach with Extreme Thermal Stability for Extreme and Dynamic EnvironmentsKhalid KhtatbaSeyed Amir PaknejadAli MansourianSamjid H. Mannan
- Development of thermal conductive sheet with low interfacial heat resistanceMasao TomikawaAkira ShimadaYoichi Shinba
- Product Development of High Power Electronics for High Reliability ApplicationsTiago M. L. TeixeiraJuan Bevan
- High Temperature EEPROM Using a Differential Approach for High ReliabilityHolger KappertSebastian BraunMichael AlfringNorbert KordasAndreas KelbererStefan DreinerRainer Kokozinski
- Evaluation of printed-circuit boards materials for high temperature operationOriol Aviño-SalvadoWissam SabbahCyril ButtayHervé MorelPascal Bevilacqua
- Intermetallic connections for high temperature applicationsA. NovikovM. Nowottnick
Vedum, Jon, Morten H. Røed, Sigbjørn Kolberg, Magnus Hjelstuen, Anders E. Liverud, and Øyvind N. Stamnes. 2017. “Development of a Novel Logging Tool for 450°C Geothermal Wells.” IMAPSource Proceedings 2017 (HiTEN): 11–19. https://doi.org/10.4071/2380-4491.2017.HiTEN.11.