ISSN 2380-4505
Vol. 2017, Issue HiTEN, 2017July 01, 2017 EDT
Development of thermal conductive sheet with low interfacial heat resistance
Development of thermal conductive sheet with low interfacial heat resistance
Masao Tomikawa, Akira Shimada, Yoichi Shinba,
Articles in Vol. 2017, Issue HiTEN, 2017
Vol. 2017, Issue HiTEN, 2017
- A High Temperature Linear Wideband Power Amplifier for a Downhole Communication SystemS. Reza HiemstraBrannon M. KerriganDong S. Ha
- Effect of isothermal aging at 250 °C on shear strength of joints using Sn-Coated Cu particle paste for high-temperature applicationHiroshi NishikawaXiangdong LiuSiliang He
- Time-efficient sintering processes to attach power devices using nanosilver dry filmJingru DaiJianfeng LiPearl AgyakwaChristopher Mark Johnson
- Evaluation of Thermal Resistance Degradation of SiC Power Module Corresponding to Thermal Cycle TestFumiki KatoHiroki TakahashiHidekazu TanisawaKenichi KouiShinji SatoYoshinori MurakamiHiroshi NakagawaHiroshi YamaguchiHiroshi Sato
- Potential of Zn-Al Solder Alloy for High Temperature SiC Power ModuleHidekazu TanisawaFumiki KatoHiroki TakahashiKenichi KouiShinji SatoYoshinori MurakamiKinuyo WatanabeHiroshi YamaguchiHiroshi Sato
- A High Temperature 4H-SiC Voltage Reference for Depletion Mode GaN-Based CircuitsZiHao ZhangJebreel M. SalemDong Sam Ha
- An Advanced Extreme Environment Wireless Telemetry System for Turbine Blade InstrumentationJohn R. FraleyBrett SparkmanStephen MindenJoshua McConkey
- Design and fabrication of a power Si/SiC LDMOSFET for high temperature applicationsF. LiP.M. GammonC.W. ChanF. GityT. TrajkovicV. KilchytskaV. PathiranaK. Ben AliD. FlandreP.A. MawbyJ.W. Gardner
- Creation of an ARM® Cortex®-M0 microcontroller for high temperature embedded systemsR. BannatyneD. GiffordK. KleinK. McCarvilleC. MerrittS. Neddermeyer
- Development of a Novel Logging Tool for 450°C Geothermal WellsJon VedumMorten H. RøedSigbjørn KolbergMagnus HjelstuenAnders E. LiverudØyvind N. Stamnes
- The Tamessa project: a practical application of a 225°C multilayer PCB/SMT/COB systemPiers R. Tremlett
- Thermal reliability of SiC device with Cu sintering die-attach processed at 250°C in N2 gasShijo NagaoHiroki YoshikawaHirofumi FujitaAkio ShimoyamaShinya SekiHao ZhangKatsuaki Suganuma
- Microstructure stability of TLPS interconnects in high operating temperature applicationsCatherine Shearer
- High Temperature Quadrature Amplitude Modulation over Orthogonal Frequency Division MultiplexingAvery CashionGrzegorz Cieslewki
- A Precision Data Acquisition and Control Platform for 200°C+ High Temperature EnvironmentsJeff WatsonMaithil PachchigarRoss BannatyneClay MerrittChristopher ConradGlenn SmollingerEarle Drack
- SOI Operational Amplifier Applications in 300°C Operating EnvironmentCheng-Po ChenLucian StoicaEmad AndarawisRussell Simpson
- High Temperature, Time Domain Sensor Interface based on Phase ShifterEmna ChabchoubFranck BadetsMohamed MasmoudiPascal NouetFrédérick Mailly
- Effects of Bond Pad Thickness on Shear Strength of Copper Wire BondsSubramani ManoharanChandradip PatelStevan HunterPatrick McCluskey
- Die-Attach Voiding Reduction in Gold Alloy Solder PreformsBernard LeavittAndy C. Mackie
- High-Precision Mixed-Signal Sensor Interface for a Wide Temperature Range [0° – 300°C]Georg GläserDagmar KirstenAndré RichterMarco ReinhardGerrit KroppDirk M. Nuernbergk
- Evaluation of High Temperature Joining Technologies for Semiconductor Die AttachSiyuan QiChris PowleyMaria MirgkizoudiAdele PliscottPeter Collier
- Comparison of a Current Mode Reference Generator vs.a ΔVBE Bandgap Circuit in a 1.0μm Partially-Depleted Silicon-On-Insulator CMOS Process for High Temperature (220 °C) EnvironmentsAlex PikeAdrien CorneFrank BohacRavi Ananth
- A Comparison Between Solders & Transient Liquid Phase Sintered Interconnects in High Temperature Multi-Layer Ceramic CapacitorsJohn BultitudeJohn McConnellLonnie JonesGalen MillerJim MageeAllen TempletonAbhijit GuravReggie Phillips
- Sintered Silver Die Attach with Extreme Thermal Stability for Extreme and Dynamic EnvironmentsKhalid KhtatbaSeyed Amir PaknejadAli MansourianSamjid H. Mannan
- Development of thermal conductive sheet with low interfacial heat resistanceMasao TomikawaAkira ShimadaYoichi Shinba
- Product Development of High Power Electronics for High Reliability ApplicationsTiago M. L. TeixeiraJuan Bevan
- High Temperature EEPROM Using a Differential Approach for High ReliabilityHolger KappertSebastian BraunMichael AlfringNorbert KordasAndreas KelbererStefan DreinerRainer Kokozinski
- Evaluation of printed-circuit boards materials for high temperature operationOriol Aviño-SalvadoWissam SabbahCyril ButtayHervé MorelPascal Bevilacqua
- Intermetallic connections for high temperature applicationsA. NovikovM. Nowottnick
Tomikawa, Masao, Akira Shimada, and Yoichi Shinba. 2017. “Development of Thermal Conductive Sheet with Low Interfacial Heat Resistance.” IMAPSource Proceedings 2017 (HiTEN): 83–88. https://doi.org/10.4071/2380-4491.2017.HiTEN.83.